Intel Desktop Board with G33 Express Chipset BLKDG33BUC Manuale Utente
Codici prodotto
BLKDG33BUC
1
System resources (such as PCI and PCI Express*) require physical memory address locations that reduce available memory addresses above 7 GB. This may result in less
than 8 GB of memory being available to the operating system and applications.
2
Intel® Viiv™ processor technology platforms require a computer system with a processor, chipset, BIOS, enabling software and/or operating system, device drivers, and applications
designed for these features. Home networking capability and many Intel Viiv processor technology-based usage models will require additional hardware devices, software,
or services. System and component performance and functionality will vary depending on your specific hardware and software configurations. See www.intel.com/go/viiv_info
for more information.
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Remote may be sold separately.
4
64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64
architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and
software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel Viiv, Intel Core, and Intel Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel Viiv, Intel Core, and Intel Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
** Supports 95W Thermal Design Power, Intel® Core™2 Quad Processors with 1066 MHz System Bus. For information, visit www.intel.com/go/findCPU
Copyright © 2007 Intel Corporation. All rights reserved. 0507/MS/VD/PDF
Copyright © 2007 Intel Corporation. All rights reserved. 0507/MS/VD/PDF
316564-002US
Technical Specifications
Processor
Processor Support
• Intel® Core™2 Quad** and Intel® Core™2 Duo
processors in the LGA775 package
• Supports Intel® 64 Architecture
4
Chipset
Intel® G33 Express Chipset
• Intel® LE82G33 Graphics Memory Controller
Hub (GMCH)
• Intel® NH82801H I/O Controller Hub (ICH9DH)
• Serial Peripheral Interface (SPI) Flash
Graphics Memory Controller Hub (GMCH)
Graphics Memory Controller Hub (GMCH)
• Designed to support up to 8 GB
1
of system
memory using DDR2 800 / 667 SDRAM
memory
• Intel® Fast Memory Access
• Intel® Graphics Media Accelerator 3100 with
Intel® Clear Video Technology
Intel® I/O Controller Hub
Intel® I/O Controller Hub
• Ultra ATA 100 / 66 devices
• Four SATA (3.0 Gb/s) ports
• Intel® PRO 10 / 100 / 1000 network connection
USB 2.0
USB 2.0
Integrated Intel® ICH9DH controllers:
• Six back-panel ports (three dual-stack)
• Six additional ports (via three headers)
System BIOS
System BIOS
• 8 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
Intel® Rapid BIOS Boot
Intel® Rapid BIOS Boot
• Optimized POST for faster access to PC from
power-on
System Memory
Memory Capacity
• Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
Memory Types
Memory Types
• DDR2 800 / 667 SDRAM memory support
• Non-ECC Memory
Memory Modes
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
Memory Voltage
• 1.8V
Hardware Management Features
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
High-performance Intel® 82566 Gigabit
High-performance Intel® 82566 Gigabit
Network Connections
• High quality and reliability with Intel’s
world-class manufacturing and validation
• Supports Intel® Viiv™ Processor Technology-
based software and applications for simple
network setup and content sharing
Expansion Capabilities
Expansion Capabilities
• Two PCI bus add-in card connectors
• One PCI Express* x1 bus add-in card connector
• One PCI Express* x16 graphics connector
Jumpers and Front-Panel Connectors
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Three front-panel Hi-Speed USB 2.0 headers
• One 1394a header
• Front-panel audio header
• One serial header
Mechanical
Board Style
• ATX 2.2-compliant
Board Size
Board Size
• 9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard Power Requirements
Baseboard Power Requirements
• ATX12V
Environment
Operating Temperature
• 0° C to +55° C
Storage Temperature
Storage Temperature
• -40° C to +70° C
Regulations and Safety Standards
United States and Canada
CSA/UL 60950-1, First Edition
(Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
IEC 60950-1:2001, First Edition
EMC Regulations
EMC Regulations
(tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
EN 55022:2006 Class B
Japan
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
KN-22:2005 and KN-24:2005
Taiwan
CNS 13438:2006 Class B
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
Lead-Free: The symbol is used to
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in any
of the raw materials and the end product is not
greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information,
visit developer.intel.com/design/
motherbd/
Web site at www.intel.com. For the
most current product information,
visit developer.intel.com/design/
motherbd/