Fujitsu JS-05N-K PCB Mount Relay 5Vdc 1 CO, SPDT JS-05N-K Scheda Tecnica
Codici prodotto
JS-05N-K
8
JS SERIES
1. General Information
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)
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Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
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Most signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
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It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
problems (compatible).
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“LF” is marked on each outer and inner carton. (No marking on individual relays).
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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
We will ship leaded relays as long as the leaded relay inventory exists.
2. Recommended Lead Free Solder Profile
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Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005)
RoHS Compliance and Lead Free Relay Information
Reflow Solder condtion
3. Moisture Sensitivity
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Moisture Sensitivity Level standard is not applicable to electromechanical realys.
4. Tin Whisker
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SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house
test.
5. Solid State Relays
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Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating
is between the terminal and the Sn plating to avoid whisker.
We highly recommend that you confirm your actual solder conditions
Flow Solder condtion:
Pre-heating:
maximum 120˚C
Soldering:
dip within 5 sec. at
260˚C soler bath
260˚C soler bath
Solder by Soldering Iron:
Soldering Iron
Temperature:
Temperature:
maximum 360˚C
Duration:
maximum 3 sec.
max. 120 sec.
90~120 sec.
20~30 sec.
(duration)
Cooling
Pre-heating
Soldering
Peak Temp.: max. 250˚C
250
220
130
170
temperature (˚C
)