Intel 2 Duo E8200 BX80570E8200 Scheda Tecnica

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BX80570E8200
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Electrical Specifications
28
Datasheet
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
GTLREF is to be generated from V
TT
 by a voltage divider of 1% resistors. If an Adjustable 
GTLREF circuit is used on the board (for Quad-Core processors compatibility) the two 
GTLREF lands connected to the Adjustable GTLREF circuit require the following: 
GTLREF_PU = 50 Ω, GTLREF_PD = 100 Ω. 
3.
R
TT
 is the on-die termination resistance measured at V
TT
/3 of the GTL+ output driver. 
4.
COMP resistance must be provided on the system board with 1% resistors. COMP[3:0] and 
COMP8 resistors are to V
SS
.
2.8
Clock Specifications
2.8.1
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the 
processor. As in previous generation processors, the processor’s core frequency is a 
multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its 
default ratio during manufacturing. The processor supports Half Ratios between 7.5 
 for the processor supported ratios.
The processor uses a differential clocking implementation. For more information on the 
processor clocking, contact your Intel field representative.
Table 14.
GTL+ Bus Voltage Definitions
Symbol
Parameter
Min
Typ
Max
Units
Notes
1
GTLREF_PU
GTLREF_PD
GTLREF pull up on Intel
®
 
3 Series Chipset family 
boards
57.6 * 0.99
57.6
57.6 * 
1.01
Ω
2
GTLREF pull down on 
Intel
®
 3 Series Chipset 
family boards
100 * 0.99
100
100 * 1.01
Ω
2
R
TT
Termination Resistance
45
50
55
Ω
3
COMP[3:0]
COMP Resistance
49.40
49.90
50.40
Ω
4
COMP8
COMP Resistance
24.65
24.90
25.15
Ω
4