Texas Instruments Audio Power Amplifier Evaluation Module TPA1517DWPEVM TPA1517DWPEVM Scheda Tecnica
Codici prodotto
TPA1517DWPEVM
9
Operation Notes
The connection pins of the TPA1517DWP EVM are on a 0.1” grid for easy
interface to standard plugboard based prototype systems.
interface to standard plugboard based prototype systems.
The thermal layout of the EVM is important. Linear Audio Power Amplifiers
dissipated large amounts of heat during operation. The data sheet for the
TPA1517 (SLOS162A) details heat dissipation for 12 and 14.5 volt
operations. The PowerPAD
dissipated large amounts of heat during operation. The data sheet for the
TPA1517 (SLOS162A) details heat dissipation for 12 and 14.5 volt
operations. The PowerPAD
TM
package has an exposed thermal pad on the
underside of the IC. This pad must be thermally connected to as much copper
area as possible on the surface of the PCB or to internal ground planes. Special
consideration should be given to the thermal layout due to the effect on
maximum ambient temperature operation. It is recommended to place a
copper area under the IC equal to the flat area of the IC body. This copper
area should then be connected to the ground plane layer by vias. The vias
should not use WEBed connections but should have a solid connection to the
copper areas. The solid connections make a much better thermal connection
area as possible on the surface of the PCB or to internal ground planes. Special
consideration should be given to the thermal layout due to the effect on
maximum ambient temperature operation. It is recommended to place a
copper area under the IC equal to the flat area of the IC body. This copper
area should then be connected to the ground plane layer by vias. The vias
should not use WEBed connections but should have a solid connection to the
copper areas. The solid connections make a much better thermal connection