Texas Instruments Evaluation Module for TPS82672 600-mA, High-Efficiency MicroSiP Step-Down Converter TPS82672EVM-646 TPS82672EVM-646 Scheda Tecnica

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TPS82672EVM-646
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User
'
s Guide
SLVU383D
October 2010
Revised November 2011
TPS826xxEVM
This user
s guide describes the characteristics, operation, and use of the TPS826xxEVM-646 evaluation
module (EVM). The TPS826xxEVM-646 is a fully assembled and tested platform for evaluating the
performance of the
,
and
high-frequency,
synchronous, step-down dc-dc converters optimized for battery-powered portable applications. This
document includes schematic diagrams, a printed circuit board (PCB) layout, bill of materials, and test
data. Throughout this document, the abbreviations EVM and TPS826xxEVM and the term evaluation
module 
are synonymous with the TPS826xxEVM-646 unless otherwise noted.
Contents
1
Introduction
..................................................................................................................
1.1
Features
.............................................................................................................
1.2
Applications
.........................................................................................................
1.3
EVM Ordering Options
............................................................................................
2
TPS826xxEVM Schematic
.................................................................................................
3
Connector and Test Point Descriptions
..................................................................................
3.1
Input / Output Connectors: TPS826xxEVM
.....................................................................
3.2
Jumpers and Switches
............................................................................................
4
Test Configuration
..........................................................................................................
4.1
Hardware Setup
....................................................................................................
4.2
Procedure
...........................................................................................................
5
TPS826xxEVM Test Data
..................................................................................................
5.1
Thermal Performance
.............................................................................................
6
TPS826xxEVM Assembly Drawings and Layout
.......................................................................
7
Bill of Materials
.............................................................................................................
8
Marking Information
.......................................................................................................
List of Figures
1
TPS826xxEVM Schematic
.................................................................................................
2
Hardware Board Connection
..............................................................................................
3
Top Side Thermal Measurement
..........................................................................................
4
Bottom Side Thermal Measurement
......................................................................................
5
TPS826xxEVM Component Placement (Top View)
....................................................................
6
TPS826xxEVM Top-Side Copper (Top View)
...........................................................................
7
TPS826xxEVM Bottom-Side Copper (Bottom View)
..................................................................
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1
SLVU383D
October 2010
Revised November 2011
TPS826xxEVM
Copyright
©
2010
2011, Texas Instruments Incorporated