Texas Instruments DAC8801EVM Evaluation Module DAC8801EVM DAC8801EVM Scheda Tecnica
Codici prodotto
DAC8801EVM
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PCB Design and Performance
contributes to the error of the MDAC output. To ensure that the return currents are handled properly, route
the appropriate signals only in their respective sections, meaning the analog traces should only lay directly
above or below the analog section and the digital traces in the digital section. Minimize the length of the
traces but use the biggest possible trace width allowable in the design. These design practice discussed
can be seen in the following figures.
the appropriate signals only in their respective sections, meaning the analog traces should only lay directly
above or below the analog section and the digital traces in the digital section. Minimize the length of the
traces but use the biggest possible trace width allowable in the design. These design practice discussed
can be seen in the following figures.
The DAC8801/11EVM board is constructed on a four-layer printed-circuit board using a copper-clad FR-4
laminate material. The printed-circuit board has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm
(3.2000 inch), and the board thickness is 1,5748 mm (0.0620 inch).
laminate material. The printed-circuit board has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm
(3.2000 inch), and the board thickness is 1,5748 mm (0.0620 inch).
through
show the
individual artwork layers.
Figure 2. Top Silkscreen
Figure 3. Layer 1 (Top Signal Plane)
5
SLAU151A – January 2005 – Revised November 2009
DAC8801/11EVM
Copyright © 2005–2009, Texas Instruments Incorporated