Microchip Technology SC70EV Manuale Utente
Installation and Operation
© 2009 Microchip Technology Inc.
DS51874A-page 17
2.4.4.2
SOT-23-6
The 6-pin SOT-23 footprint is laid out for packages that have a typical pitch of 0.65 mm
(BSC), a maximum lead width of 0.45 mm, and a maximum molded package width of
1.75 mm. Six lead SOT-23 packages that meet these characteristics should be able to
be used with this board.
(BSC), a maximum lead width of 0.45 mm, and a maximum molded package width of
1.75 mm. Six lead SOT-23 packages that meet these characteristics should be able to
be used with this board.
2.4.4.3
DIP-8
The 8-pin DIP footprint is laid out for packages that have a typical pitch of 100 mil
(BSC), a maximum lead width of 22 mil, and a molded package width of 300 mil. 8-lead
SOT-23 packages that meet these characteristics should be able to be used with this
board.
(BSC), a maximum lead width of 22 mil, and a molded package width of 300 mil. 8-lead
SOT-23 packages that meet these characteristics should be able to be used with this
board.
2.4.4.4
PASSIVE COMPONENTS
All passive components (RXU, RXD, and CX) use a surface mount 805 footprint. Any
component that has a compatible footprint could be used with this board.
component that has a compatible footprint could be used with this board.
2.4.4.5
HEADER (1X6)
The header has a typical pitch of 100 mil (BSC). This header is designed to be
compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.
compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.