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Analog Devices AD9609 Evaluation Board AD9609-20EBZ AD9609-20EBZ Scheda Tecnica

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AD9609-20EBZ
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AD9609 
 
 
Rev. 0 | Page 32 of 32 
OUTLINE DIMENSIONS 
 
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.65
3.50 SQ
3.35
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
10
06
08
-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
 
Figure 55. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 
9 mm × 9 mm Body, Very Thin Quad (CP-32-4) 
Dimensions shown in millimeters 
 
ORDERING GUIDE 
Model Temperature 
Range 
Package Description 
Package Option 
AD9609BCPZ-80
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 
CP-32-4 
AD9609BCPZRL7-80
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 
CP-32-4 
AD9609BCPZ-65
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)  
CP-32-4 
AD9609BCPZRL7-65
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)  
CP-32-4 
AD9609BCPZ-40
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)  
CP-32-4 
AD9609BCPZRL7-40
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)  
CP-32-4 
AD9609BCPZ-20
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)  
CP-32-4 
AD9609BCPZRL7-20
–40°C to +85°C 
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)  
CP-32-4 
Evaluation 
Board 
 
Evaluation 
Board 
 
Evaluation 
Board 
 
Evaluation 
Board 
 
 
1
 Z = RoHS Compliant Part. 
2
 The exposed paddle (Pin 0) is the only GND connection on the chip and must be connected to the PCB AGND. 
 
 
©2009 Analog Devices, Inc. All rights reserved. Trademarks and  
 registered trademarks are the property of their respective owners. 
  
D08541-0-10/09(0)