STMicroelectronics STEVAL-TLL009V1 Camera flash based on the STCF07 STEVAL-TLL009V1 STEVAL-TLL009V1 Scheda Tecnica
Codici prodotto
STEVAL-TLL009V1
STCF07
PCB design
Doc ID 16757 Rev 3
15/26
9 PCB
design
9.1 PCB
design
rules
The STCF07 is a powerful switched device, so the PCB must be designed following the
rules for designing switched supplies. It is recommended to use at least a two-layer PCB.
The power wiring must be as short and wide as possible, due to the high current. All external
components should be placed close to the STCF07. High-energy switched loops should be
as small as possible to reduce EMI. Most LEDs require cooling, which may be implemented
by a defined copper area on the PCB. Use the reference guide for each LED to design the
heatsink. Place the R
rules for designing switched supplies. It is recommended to use at least a two-layer PCB.
The power wiring must be as short and wide as possible, due to the high current. All external
components should be placed close to the STCF07. High-energy switched loops should be
as small as possible to reduce EMI. Most LEDs require cooling, which may be implemented
by a defined copper area on the PCB. Use the reference guide for each LED to design the
heatsink. Place the R
FLASH
resistor as close as possible to pins 5 and 6. When a change of
PCB layer is required, the number of vias must be sufficient. Place the NTC resistor as close
as possible to the LED for good temperature sensing. Direct connection of GND and PGND
is needed to achieve accurate output current values. The LED current should not flow
through this track. Sensing of the voltage on the R
as possible to the LED for good temperature sensing. Direct connection of GND and PGND
is needed to achieve accurate output current values. The LED current should not flow
through this track. Sensing of the voltage on the R
FLASH
resistor must be done by
connecting a wire directly from pin 6 to the R
FLASH
resistor; no current flows through this
track. Pins 5 and 6 must be connected to the pin of the R
FLASH
resistor. The exposed pad
must be connected to the PGND, with a track as wide as possible. It is recommended to
place the copper plate, connected through the vias to the exposed pad, on the bottom layer
to create a heatsink for the device. It is further recommended that the copper plate used be
as large as possible to achieve optimal thermal performance.
place the copper plate, connected through the vias to the exposed pad, on the bottom layer
to create a heatsink for the device. It is further recommended that the copper plate used be
as large as possible to achieve optimal thermal performance.