Mikroelektronika MikroE Development Kits MIKROE-1105 Scheda Tecnica

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152 Re

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Communi
cation 
interfaces

SPI / I2S

3/2 (full duplex)

(2)

I

2

C

3

USART/ 
UART

4/2

USB 
OTG FS

Yes

USB 
OTG HS

Yes

CAN

2

SDIO

Yes

Camera interface

No

Yes

GPIOs

51

72

82

114

72

82

114

140

12-bit ADC
Number of channels

3

16

13

16

24

13

16

24

24

12-bit DAC
Number of channels

Yes

2

Maximum CPU 
frequency

 168 MHz

Operating voltage

1.8 to 3.6 V

(3)

Operating 
temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C

Junction temperature: –40 to + 125 °C

Package

LQFP64

WLCSP90

LQFP100

LQFP144

WLCSP90

LQFP100

LQFP144

UFBGA176

LQFP176

1. For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip 

Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this 

package.

2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I

2

S audio mode.

3. V

DD

/V

DDA

 minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to 

).