On Semiconductor N/A BC 327/16 PNP Case type TO 92 I(C) 1 A BC327-025G Scheda Tecnica
Codici prodotto
BC327-025G
© Semiconductor Components Industries, LLC, 2011
September, 2011 − Rev. 6
1
Publication Order Number:
BC327/D
BC327, BC327-16,
BC327-25, BC327-40
Amplifier Transistors
PNP Silicon
Features
•
These are Pb−Free Devices*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
V
CEO
−45
Vdc
Collector−Emitter Voltage
V
CES
−50
Vdc
Emitter−Base Voltage
V
EBO
−5.0
Vdc
Collector Current − Continuous
I
C
−800
mAdc
Total Power Dissipation @ T
A
= 25°C
Derate above T
A
= 25°C
P
D
625
5.0
mW
mW/°C
Total Power Dissipation @ T
A
= 25°C
Derate above T
A
= 25°C
P
D
1.5
12
W
mW/°C
Operating and Storage Junction
Temperature Range
T
J
, T
stg
−55 to +150
°C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
R
qJA
200
°C/W
Thermal Resistance, Junction−to−Case
R
qJC
83.3
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
BCxxx= Device Code
A
A
= Assembly Location
Y
= Year
WW = Work Week
G
G
= Pb−Free Package
MARKING DIAGRAM
(Note: Microdot may be in either location)
http://onsemi.com
BC
xxx
AYWW G
G
COLLECTOR
1
2
BASE
3
EMITTER
See detailed ordering, marking, and shipping information in
the package dimensions section on page 4 of this data sheet.
the package dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
1 2
3
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
TO−92
CASE 29
STYLE 17