Intel Core Duo T2300E LE80539GF0282ME Manuale Utente
Codici prodotto
LE80539GF0282ME
Package Mechanical Specifications and Pin Information
46
Datasheet
4.1.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted in the keep-
out areas. The location and quantity of the capacitors may change, but will remain
within the component keep-in. See
for keep-out zones.
4.1.3
Package Loading Specifications
Maximum mechanical package loading specifications are given in
These specifications are static compressive loading in the direction normal to the
processor. This maximum load limit should not be exceeded during shipping conditions,
standard use condition, or by thermal solution. In addition, there are additional load
limitations against transient bend, shock, and tensile loading. These limitations are
more platform specific, and should be obtained by contacting your field support.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for thermal and mechanical solution.
4.1.4
Processor Mass Specifications
The typical mass of the processor is given in
. This mass includes
all the components that are included in the package.