Intel III M 866 MHz BXM80530B866512 Scheda Tecnica
Codici prodotto
BXM80530B866512
Mobile Intel
®
Pentium
®
III Processor in BGA2 and Micro-PGA2 Packages at 1 GHz,
900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, Low-voltage 750 MHz, Low-voltage 700 MHz,
Low-voltage 600 MHz, Ultra Low-voltage 600 MHz and Ultra Low-voltage 500 MHz
Low-voltage 600 MHz, Ultra Low-voltage 600 MHz and Ultra Low-voltage 500 MHz
52 Datasheet
283653-002
5.2
Socketable Micro-PGA2 Package Dimensions
The mobile Pentium III processor is also packaged in a PPGA-B495 package (also known as
Micro-PGA2) with the back of the processor die exposed on top. Unlike previous mobile
processors with exposed die, the back of the mobile Pentium III processor die may be polished and
very smooth. The mechanical specifications for the socketable package are provided in Table 29.
Figure 23 shows the top and side views of the socketable package, and Figure 24 shows the
bottom view of the socketable package. The substrate may only be contacted within the region
between the keep-out outline and the edge of the substrate. The mobile Pentium III processor will
have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region, and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Unlike the BGA2 package, VID implementation does not require
VID pins to be depopulated on the Micro-PGA2 package.
Micro-PGA2) with the back of the processor die exposed on top. Unlike previous mobile
processors with exposed die, the back of the mobile Pentium III processor die may be polished and
very smooth. The mechanical specifications for the socketable package are provided in Table 29.
Figure 23 shows the top and side views of the socketable package, and Figure 24 shows the
bottom view of the socketable package. The substrate may only be contacted within the region
between the keep-out outline and the edge of the substrate. The mobile Pentium III processor will
have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region, and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Unlike the BGA2 package, VID implementation does not require
VID pins to be depopulated on the Micro-PGA2 package.
Table 29. Socketable Micro-PGA2 Package Specification
Symbol Parameter
Min
Max
Unit
A
Overall Height, top of die to seating plane of
interposer
interposer
3.13 3.73
mm
A
1
Pin Length
1.25 REF
mm
A
2
Die Height
0.854 REF
mm
B
Pin Diameter
0.30 REF
mm
D
2
Package Width
28.27 REF
mm
D
Die Substrate Width
27.05
27.35
mm
D
1
Die Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
mm
E
2
Package Length
34.21 REF
mm
E
Die Substrate Length
30.85
31.15
mm
E
1
Die Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
mm
e Pin
Pitch
1.27
mm
—
Pin Tip Radial True Position
≤
0.127 REF
mm
N Pin
Count
495
each
S
1
Outer Pin Center to Short Edge of Substrate
2.144 REF
mm
S
2
Outer Pin Center to Long Edge of Substrate
1.206 REF
mm
P
DIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W
Package Weight
6.2 REF
grams