Intel III M 866 MHz BXM80530B866512 Scheda Tecnica

 

 Mobile Intel

® 

Pentium

®

 III Processor in BGA2 and Micro-PGA2 Packages at 1 GHz,  

900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, Low-voltage 750 MHz, Low-voltage  

700 MHz, Low-voltage 600 MHz, Ultra Low-voltage 600 MHz and Ultra Low-voltage 500 MHz 

283653-002 Datasheet 

63 

This chapter provides needed data for designing a thermal solution.  The mobile Pentium III 
processor is either a surface mount PBGA-B495 package or a socketable PPGA-B495 package 
with the back of the processor die exposed and has a specified operational junction temperature 
(T

J

) limit. 

In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat 
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The 
processor die must be clean before the thermal solution is attached or the processor may be 
damaged.  

Table 33 provides the maximum Thermal Design Power (TDP

MAX

) dissipation and the minimum 

and maximum T

J

 temperatures for the mobile Pentium III processor.  A thermal solution should be 

designed to ensure the junction temperature never exceeds these specifications.  If no closed loop 
thermal failsafe mechanism (processor throttling) is present to maintain T

J

 within specification 

then the thermal solution should be designed to cool the TDP

MAX

 condition.  If a thermal failsafe 

mechanism is present then thermal solution could possibly be designed to a typical Thermal 
Design Power (TDP

TYP

).  TDP

TYP

 is a thermal design power recommendation based on the power 

dissipation of the processor while executing publicly available software under normal operating 
conditions at nominal voltages. TDP

TYP

 power is lower than TDP

MAX

.  Contact your Intel Field 

Sales Representative for further information.