Intel 4 HT 631 80552PG0802M2M Scheda Tecnica

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Datasheet

NOTE: Diagram does not show the attached hardware for the clip design and is provided only as a 

mechanical representation.

The boxed processor thermal module assembly for Type I BTX will not weigh more than 

1200 grams. The boxed processor thermal module assembly for Type II BTX will not 

weigh more than 1200 grams. See 

 and the appropriate processor Thermal 

and Mechanical Design Guidelines (see 

) for details on the processor weight 

and thermal module assembly requirements.

The boxed processor TMA requires an SRM assembly provided by the chassis 

manufacturer. The SRM provides the attach points for the TMA and provides structural 

support for the board by distributing the shock and vibration loads to the chassis base 

pan. The boxed processor TMA will ship with the heatsink attach clip assembly, duct 

and screws for attachment. The SRM must be supplied by the chassis hardware vendor. 

See the Support and Retention Module (SRM) External Design Requirements