Intel 1.30 GHz YA80543KC0133M Manuale Utente
Codici prodotto
YA80543KC0133M
Datasheet
69
4
Mechanical Specifications
This chapter provides the mechanical specifications of the Itanium 2 processor.
4.1
Mechanical Dimensions
The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and
an integrated heat spreader (IHS), as illustrated in
an integrated heat spreader (IHS), as illustrated in
. The interposer interfaces with the
socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS,
which is mounted on the top surface of the processor package substrate, efficiently transfers the
heat generated by the die to its surface.
which is mounted on the top surface of the processor package substrate, efficiently transfers the
heat generated by the die to its surface.
contains mechanical drawings and dimensions for the Itanium 2 processor package.
contains mechanical drawing for the power tab. All dimensions are measured in mm
and are not to scale.
Figure 4-1. Itanium
®
2 Processor Package
001160e
IHS
Interposer
Processor
Package
Substrate
(OLGA)