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6.0 
Signal Description
This chapter describes the processor signals. The signals are arranged in functional
groups according to the associated interface or category. The following notations are
used to describe the signal type.
Notation
Signal Type
I
Input pin
O
Output pin
I/O
Bi-directional Input/Output pin
The signal description also includes the type of buffer used for the particular signal
(see the following table).
Table 27.
Signal Description Buffer Types
Signal
Description
PCI Express*
PCI Express* interface signals. These signals are compatible with PCI Express 3.0
Signaling Environment AC Specifications and are AC coupled. The buffers are not 3.3 V-
tolerant. See the PCI Express Base Specification 3.0.
eDP
Embedded Display Port interface signals. These signals are compatible with VESA Rev 1.3
eDP specifications and the interface is AC coupled. The buffers are not 3.3V- tolerant.
FDI
Intel Flexible Display interface signals. These signals are based on PCI Express 2.0
Signaling Environment AC Specifications (2.7 GT/s), but are DC coupled. The buffers are
not 3.3 V- tolerant.
DMI
Direct Media Interface signals. These signals are compatible with PCI Express 2.0
Signaling Environment AC Specifications, but are DC coupled. The buffers are not 3.3 V-
tolerant.
CMOS
CMOS buffers. 1.05V- tolerant
DDR3L/DDR3L-
RS
DDR3L/DDR3L-RS buffers: 1.35 V- tolerant
A
Analog reference or output. May be used as a threshold voltage or for buffer
compensation
GTL
Gunning Transceiver Logic signaling technology
Ref
Voltage reference signal
Asynchronous 
1
Signal has no timing relationship with any reference clock.
1. Qualifier for a buffer type.
Signal Description—Processor
Mobile 4th Generation Intel
®
 Core
 Processor Family, Mobile Intel
®
 Pentium
®
 Processor Family, and Mobile Intel
®
 Celeron
®
Processor Family
July 2014
Datasheet – Volume 1 of 2
Order No.: 328901-007
83