HP 378929-B21 Dépliant
EMI
EMI
EMI
EMI
FCC Part 15 Class A
EN 55022: 1998 (CISPR22)
EN 55024: 1998 (CISPR24)
CNS 13438 Class A MIC
CD
MIC
AS/NZS 3548 Class A CE
VCCI Class A
EN 55024: 1998 (CISPR24)
CNS 13438 Class A MIC
CD
MIC
AS/NZS 3548 Class A CE
VCCI Class A
Safety
Safety
Safety
Safety
UL to UL 60950, Third Edition
C-UL to CAN/CSA C22.2 No. 60950-00, Third Edition
TUV/GS to EN 60950:2000
CB to IEC 60950 with all country deviations
NOM to NOM-019-SCFI
CE Marking
C-UL to CAN/CSA C22.2 No. 60950-00, Third Edition
TUV/GS to EN 60950:2000
CB to IEC 60950 with all country deviations
NOM to NOM-019-SCFI
CE Marking
Power
Power
Power
Power
Requirements
Requirements
Requirements
Requirements
Requirements
-48VDC: 1050 mA, 125 W maximum (per interconnect switch)
Temperature
Temperature
Temperature
Temperature
Range
Range
Range
Range
Range
Operating
50° to 95° F (10° to 35° C)
Non-operating
-22° to 140° F (-30° to 60° C)
Relative Humidity
Relative Humidity
Relative Humidity
Relative Humidity
(non-condensing)
(non-condensing)
(non-condensing)
(non-condensing)
(non-condensing)
Operating
20% to 80%
Non-operating
5% to 95%
Wet Bulb
Wet Bulb
Wet Bulb
Wet Bulb
Temperature
Temperature
Temperature
Temperature
Temperature
Operating
82.4° F (28° C)
Non-operating
101.7° F (38.7° C)
NOTE:
NOTE:
NOTE:
NOTE: Operating temperature has an altitude derating of 34° F/1° C per 1,000 ft/304.8 m. No direct
sunlight. Upper operating limit is 10,000 ft/3,048 m or 70Kpa/10.1 psia. Upper non-operating limit is
30,000 ft/9,144 m or 30.3 KPa/4.4 psia. Storage maximum humidity of 95% is based on a maximum
temperature of 113° F/45° C. Altitude maximum for storage is 70 KPa.
sunlight. Upper operating limit is 10,000 ft/3,048 m or 70Kpa/10.1 psia. Upper non-operating limit is
30,000 ft/9,144 m or 30.3 KPa/4.4 psia. Storage maximum humidity of 95% is based on a maximum
temperature of 113° F/45° C. Altitude maximum for storage is 70 KPa.
Environment-friendly
Environment-friendly
Environment-friendly
Environment-friendly
Products and Approach
Products and Approach
Products and Approach
Products and Approach
Products and Approach
End-of-life Management
End-of-life Management
End-of-life Management
End-of-life Management
and Recycling
and Recycling
and Recycling
and Recycling
and Recycling
Hewlett-Packard offers end-of-life HP product return, trade-in, and recycling
programs in many geographic areas. For trade-in information, please go to
programs in many geographic areas. For trade-in information, please go to
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.
responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide
treatment information for each product type for use by treatment facilities.
This information (product disassembly instructions) is posted on the Hewlett
Packard web site at:
treatment information for each product type for use by treatment facilities.
This information (product disassembly instructions) is posted on the Hewlett
Packard web site at:
. These instructions may
be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
customers who integrate and re-sell HP equipment.
© Copyright 2007 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice.
Microsoft and Windows NT are US registered trademarks of Microsoft Corporation. Intel is a US registered trademark of Intel
Corporation.
Corporation.
The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and
services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial
errors or omissions contained herein.
services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial
errors or omissions contained herein.
QuickSpecs
HP BladeSystem p-Class Interconnect Components
HP BladeSystem p-Class Interconnect Components
HP BladeSystem p-Class Interconnect Components
HP BladeSystem p-Class Interconnect Components
Technical Specifications
DA - 12331 Worldwide — Version 4 — September 12, 2007
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