Intel 4 551 BX80547PG3400EK Manuale Utente
Codici prodotto
BX80547PG3400EK
12
Datasheet
Introduction
The Pentium 4 processor on 90 nm process in the LGA775-land package will also include the
Execute Disable Bit capability previously available in Intel
Execute Disable Bit capability previously available in Intel
®
Itanium
®
processors. This feature
combined with a support operating system allows memory to be marked as executable or non-
executable. If code attempts to run in non-executable memory the processor raises an error to the
operating system. This feature can prevent some classes of viruses or worms that exploit buffer
overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel
executable. If code attempts to run in non-executable memory the processor raises an error to the
operating system. This feature can prevent some classes of viruses or worms that exploit buffer
overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel
®
Architecture Software Developer's Manual for more detailed information.
Intel will enable support components for the processor including heatsink, heatsink retention
mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be
completed from the top of the baseboard and should not require any special tooling.
mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be
completed from the top of the baseboard and should not require any special tooling.
The processor includes an address bus powerdown capability that removes power from the address
and data pins when the FSB is not in use. This feature is always enabled on the processor.
and data pins when the FSB is not in use. This feature is always enabled on the processor.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset
components). The FSB is a multiprocessing interface to processors, memory, and I/O.
components). The FSB is a multiprocessing interface to processors, memory, and I/O.
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
•
Pentium 4 processor on 90 nm process in the 775-land package — Processor in the FC-
LGA4 package with a 1-MB L2 cache.
LGA4 package with a 1-MB L2 cache.
•
Processor — For this document, the term processor is the generic form of the Pentium 4
processor in the 775-land package.
processor in the 775-land package.
•
Keep-out zone — The area on or near the processor that system design can not use.
•
Intel 925X/915G/915P Express chipsets — Chipsets that supports DDR and DDR2 memory
technology for the Pentium 4 processor in the 775-land package.
technology for the Pentium 4 processor in the 775-land package.
•
Processor core — Processor core die with integrated L2 cache.
•
FC-LGA4 package — The Pentium 4 processor in the 775-land package is available in a Flip-
Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with
an integrated heat spreader (IHS).
Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with
an integrated heat spreader (IHS).
•
LGA775 socket — The Pentium 4 processor in the 775-land package mates with the system
board through a surface mount, 775-land, LGA socket.
board through a surface mount, 775-land, LGA socket.
•
Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.