Mitsumi electronic QS0J71GF11-T2 Manuale Utente

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The following is a list of precautions for handling the master/local 
module:

(1) Do not drop or apply strong shock to the module case since it is 

made from resin. Doing so may cause failure.

(2) Do not remove the printed-circuit board of the module from the 

case. Doing so may cause failure.

(3) Prevent foreign matter such as dust or wire chips from entering the 

module. Such foreign matter can cause a fire, failure, or 
malfunction.

(4) A protective film is attached to the top of the module to prevent 

foreign matter, such as wire chips, from entering the module during 
wiring. Do not remove the film during wiring. Remove it for heat 
dissipation before system operation. 

(5) Before handling the module, touch a grounded metal object to 

discharge the static electricity from the human body. Failure to do 
so may cause the module to fail or malfunction. 

(6) Tighten the screws such as module fixing screws within the 

following range.

(7) To mount the module, while pressing the module mounting lever 

located in the lower part of the module, fully insert the module fixing 
projection(s) into the hole(s) in the base unit and press the module 
until it snaps into place. Be sure to tighten the module fixing screw 
within the specified tightening torque range.
Incorrect mounting may cause malfunction, failure or drop of the 
module.

For details on installation environment, refer to the following.
QSCPU User's Manual (Hardware Design, Maintenance and 
Inspection)

Screw

Tightening torque range

Module fixing screw (M3 × 12)

0.36 to 0.48N

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