DELL FC430 Manuale Utente

• Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A4 

are available. For dual-processor systems, sockets A1 to A4 and sockets B1 to B4 are available.

• Populate all sockets with white release tabs first and then populate the sockets with black release tabs.
• Populate the sockets by highest capacity DIMM in the following order - first-in-sockets with white 

release tabs and then black. For example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB 

DIMMs in the sockets with white release tabs and 8 GB DIMMs in the sockets with black release tabs.

• In a dual-processor configuration, the memory configuration for each processor must be identical. 

For example, if you populate socket A1 for processor 1, then populate socket B1 for processor 2.

• DIMMs of different sizes can be mixed provided other memory population rules are followed (for 

example, 4 GB and 8 GB memory modules can be mixed).

• The memory module for DIMM sockets A3, A4, B3, and B4 need to be inserted 180 ° reverse with 

regard to the DIMMS in the sockets A1, A2, B1, and B2.

• Follow the mode-specific guidelines to maximize performance. For more information, see 

Table 2. Heat sink — processor configurations

Processor 

configuration

Processor type (in 

Watts)

Heat 

sink 

width

Number of DIMMs

Maximum system 

capacity

Reliability, Availability, 

and Serviceability (RAS) 

features

Single processor 120 W or 140 W

68 

mm

4

4

Dual processor

120 W

68 

mm

8

8

Mode-specific guidelines

Four memory channels are allocated to each processor. The allowable configurations depend on the 
memory mode selected.

NOTE: x4 and x8 DRAM based DIMMs can be mixed providing support for RAS features. However, 
all guidelines for specific RAS features must be followed. x4 DRAM based DIMMs retain Single 
Device Data Correction (SDDC) in memory optimized (independent channel) mode. x8 DRAM based 
DIMMs require Advanced ECC mode to gain SDDC.

The following sections provide additional slot population guidelines for each mode.

Advanced ECC (Lockstep)

Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This 

protects against single DRAM chip failures during normal operation.
Memory installation guidelines:

• Memory modules must be identical in size, speed, and technology.
• DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies 

for sockets with black release tabs. This ensures that identical DIMMs are installed in matched pairs - 

for example, A1 with A2, A3 with A4 and so on.

Processor

Configuration

Memory population rules

Memory population 

information

Single CPU

Advanced ECC 

(Lockstep)

{1,2},{3,4}

Numbers inside the brackets 

indicate the slots that must be 

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