Manuali utente per Huawei MC509 CDMA LGA

Sommario

• About This Document

  3
• 1 Introduction

  8
• 2 Overall Description

  9
  • 2.1 About This Chapter

    9
  • 2.2 Function Overview

    9
    • Table 2-1 Feature

      9
  • 2.3 Circuit Block Diagram

    11
    • Figure 2-1 Circuit block diagram of the MC509 module

      11
  • 2.4 Application Block Diagram

    12
    • Figure 2-2 Application block diagram of the MC509 module

      12
• 3 Description of the Application Interfaces

  13
  • 3.1 About This Chapter

    13
  • 3.2 LGA Interface

    13
    • Table 3-1 Definitions of pins on the LGA interface

      14
    • Figure 3-1 Bottom view of sequence of LGA interface pins

      22
  • 3.3 Power Interface

    22
    • 3.3.1 Overview

      22
      • Table 3-2 Definitions of the pins on the power supply interface

        23
    • 3.3.2 VBAT Interface

      23
    • 3.3.3 VCOIN Interface

      24
      • Sudden momentary power loss

        24
        • Table 3-3 Keep-alive capacitor values vs.SMPL timer settings

          24
      • Real-time clock

        24
        • Table 3-4 Coin cell characteristics

          25
        • Figure 3-2 VCOIN interface circuit

          25
    • 3.3.4 Output Power Supply Interface

      25
  • 3.4 Signal Control Interface

    26
    • 3.4.1 Overview

      26
      • Table 3-5 Pins on the signal control interface

        26
    • 3.4.2 Input Signal Control Pins

      27
      • Figure 3-3 Connections of the POWER_ON_OFF and RESIN_N pins

        28
      • Power-On Time Sequence

        28
        • Figure 3-4 Power on timing sequence

          28
        • Table 3-6 Power on timing

          29
        • Figure 3-5 Power off timing

          29
        • Table 3-7 Power off timing

          29
      • RESIN_N

        30
    • 3.4.3 Output Signal Control Pin (TBD)

      30
    • 3.4.4 WAKEUP_IN Signal

      30
    • 3.4.5 WAKEUP_OUT Signal

      30
      • Figure 3-6 Connections of the WAKEUP_IN and WAKEUP_OUT pins

        31
  • 3.5 UART Interface

    31
    • 3.5.1 Overview

      31
      • Table 3-8 UART interface signals

        32
    • 3.5.2 Circuit Recommended for the UART Interface

      32
      • Figure 3-7 Connection of the UART interface in the MC509 module (DCE) with the host (DTE)

        33
  • 3.6 USB Interface

    33
    • Table 3-9 USB interface signals

      33
    • Table 3-10 DC Electrical Characteristics of USB

      34
    • Figure 3-8 Recommended circuit of USB interface

      34
  • 3.7 UIM Card Interface

    35
    • 3.7.1 Overview

      35
      • Table 3-11 UIM card interface signals

        35
    • 3.7.2 Circuit Recommended for the UIM Card Interface

      35
      • Figure 3-9 Circuit of the UIM card interface

        36
      • Figure 3-10 Pin definition of UIM Socket

        36
    • 3.7.3 ESD Protection for the UIM Card Interface

      37
      • Figure 3-11 ESD protection circuit on the UIM card

        37
  • 3.8 Audio Interface

    37
    • 3.8.1 Analogue Audio

      37
      • Figure 3-12 Circuit diagram of the interface of the first audio channel

        38
      • Figure 3-13 Circuit diagram of the interface of the second audio channel

        39
    • 3.8.2 Digital Audio

      39
      • Table 3-12 Signals on the digital audio interface

        39
      • Figure 3-14 Circuit diagram of the interface of the PCM (MC509 is used as PCM master)

        40
      • Primary Mode

        40
  • 3.9 General Purpose I/O Interface

    40
  • 3.10 JTAG Interface

    41
  • 3.11 RF Antenna Interface

    41
    • Table 3-13 Signals on RF Antenna interface

      42
  • 3.12 NC Pins

    42
• 4 RF Specifications

  43
  • 4.1 About This Chapter

    43
  • 4.2 Antenna Installation Guidelines

    43
  • 4.3 Operating Frequencies

    43
  • 4.4 Conducted RF Measurement

    44
    • 4.4.1 Test Environment

      44
    • 4.4.2 Test Standards

      44
  • 4.5 Conducted Rx Sensitivity and Tx Power

    44
    • 4.5.1 Conducted Receive Sensitivity

      44
      • Table 4-1 MC509 conducted Rx sensitivity (Unit: dBm)

        44
    • 4.5.2 Conducted Transmit Power

      45
      • Table 4-2 MC509 conducted Tx power (Unit: dBm)

        45
  • 4.6 Antenna Design Requirements

    45
    • 4.6.1 Antenna Design Indicators

      45
      • Antenna Efficiency

        45
      • S11 or VSWR

        45
      • Polarization

        46
      • Radiation Pattern

        46
      • Gain and Directivity

        46
    • 4.6.2 Interference

      47
    • 4.6.3 CDMA Antenna Requirements

      47
    • 4.6.4 Radio Test Environment

      48
      • Passive Tests

        48
      • Active Tests

        48
        • Figure 4-1 SATIMO microwave testing chamber

          48
• 5 Electrical and Reliability Features

  49
  • 5.1 About This Chapter

    49
  • 5.2 Extreme Working Conditions

    49
    • Table 5-1 Extreme working conditions for the MC509 module

      49
  • 5.3 Working and Storage Temperatures and Humidity

    50
    • Table 5-2 Working and storage temperatures and humidity for the MC509 module

      50
  • 5.4 Electrical Features of Application Interfaces

    50
    • Table 5-3 Electrical features of application interfaces

      50
  • 5.5 Power Supply Features

    51
    • 5.5.1 Input Power Supply

      51
      • Table 5-4 Requirements for input power of the MC509 module

        51
      • Figure 5-1 Power Supply During Burst Emission

        51
      • Table 5-5 Requirements for input current of the MC509 module

        51
    • 5.5.2 Power Consumption

      52
      • Table 5-6 Averaged standby DC power consumption

        52
  • 5.6 Reliability Features

    52
    • Table 5-7 Test conditions and results of the mechanical reliability of the MC509 module

      52
  • 5.7 EMC and ESD Features

    54
• 6 Mechanical Specifications

  55
  • 6.1 About This Chapter

    55
  • 6.2 Dimensions and interfaces

    55
    • Figure 6-1 Dimensions of MC509

      55
  • 6.3 PCB Pad Design

    56
    • Figure 6-2 PCB pad design

      57
  • 6.4 Label

    57
    • Figure 6-3 Nameplate

      58
  • 6.5 Packing System

    58
• 7 Certifications

  59
  • 7.1 About This Chapter

    59
    • Table 7-1 Product Certifications

      59
  • 7.2 Environmental Protection Certification and Test

    60
    • 7.2.1 RoHS

      60
      • SGS RoHS Test

        60
    • 7.2.2 WEEE

      61
    • 7.2.3 PVC-free

      62
  • 7.3 National Compulsory Certification

    62
    • 7.3.1 Product Certification

      62
    • 7.3.2 Importance of Product Certification

      62
    • 7.3.3 Product Certification Test Items

      62
    • 7.3.4 Product Certification Classifications

      63
    • 7.3.5 Certification Modes

      63
    • 7.3.6 Certification Types

      64
      • CE Certification

        64
      • FCC Certification

        64
      • NCC (DGT) Certification

        65
      • A-Tick Certification

        66
      • TELEC and JATE Certification (Japan)

        66
      • IC Certification (Canada)

        67
      • Chinese Certifications

        68
      • RoHS, REACH, JGPSSI, and Chinese Environmental Protection

        70
    • 7.3.7 Guide to Product Certification

      72
      • CE Certification and FCC Certification

        72
      • IC Certification

        73
      • NCC Certification

        73
  • 7.4 GCF and PTCRB

    73
    • 7.4.1 GCF Certification

      73
    • 7.4.2 PTCRB Certification

      75
    • 7.4.3 Overall-System Certification

      75
      • Overall-System GCF Certification

        76
        • 1. Register as a member of the GCF.

          76
        • 2. Choose a test organization.

          76
        • 3. Discuss test details with the test organization.

          77
        • 4. Perform overall-system certification.

          77
        • 5. Obtain the test report and the DOC.

          77
      • Overall-System PTCRB Certification

        77
        • 1. Register as a guest of the PTCRB.

          78
        • 2. Choose a test organization.

          78
        • 3. Discuss test details with the test organization.

          78
        • 4. Submit an overall-system certification application on the PTCRB website and designate a test organization.

          78
        • 5. Perform overall-system certification.

          78
        • 6. Obtain the test report and submit relevant materials.

          78
      • GCF and PTCRB Certification

        78
• 8 Safety Information

  79
  • 8.1 Interference

    79
  • 8.2 Medical Device

    79
  • 8.3 Area with Inflammables and Explosives

    79
  • 8.4 Traffic Security

    80
  • 8.5 Airline Security

    80
  • 8.6 Safety of Children

    80
  • 8.7 Environment Protection

    80
  • 8.8 WEEE Approval

    80
  • 8.9 RoHS Approval

    80
  • 8.10 Laws and Regulations Observance

    81
  • 8.11 Care and Maintenance

    81
  • 8.12 Emergency Call

    81
  • 8.13 Specific Absorption Rate (SAR)

    81
  • 8.14 Regulatory Information

    82
    • 8.14.1 CE Approval (European Union)

      82
    • 8.14.2 FCC Statement

      82
• 9 Appendix A Circuit of Typical Interfaces

  83
• 10 Appendix B Acronyms and Abbreviations

  85