Manuali utente per Intel Core 2 Duo Desktop Processor E6550

Sommario

• Contents

  3
  • Figures

    5
  • Tables

    6
• Revision History

  7
• Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Features

  9
• 1 Introduction

  11
  • 1.1 Terminology

    12
    • 1.1.1 Processor Terminology

      12
  • 1.2 References

    14
    • Table 1. Reference Documents

      14
• 2 Electrical Specifications

  15
  • 2.1 Power and Ground Lands

    15
  • 2.2 Decoupling Guidelines

    15
    • 2.2.1 VCC Decoupling

      15
    • 2.2.2 Vtt Decoupling

      15
    • 2.2.3 FSB Decoupling

      16
  • 2.3 Voltage Identification

    16
    • Table 2. Voltage Identification Definition

      17
  • 2.4 Market Segment Identification (MSID)

    18
    • Table 3. Market Segment Selection Truth Table for MSID[1:0], , ,

      18
  • 2.5 Reserved, Unused, and TESTHI Signals

    18
  • 2.6 Voltage and Current Specification

    19
    • 2.6.1 Absolute Maximum and Minimum Ratings

      19
      • Table 4. Absolute Maximum and Minimum Ratings

        20
    • 2.6.2 DC Voltage and Current Specification

      20
      • Table 5. Voltage and Current Specifications

        20
      • Table 6. VCC Static and Transient Tolerance

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      • Figure 1. VCC Static and Transient Tolerance

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    • 2.6.3 VCC Overshoot

      24
      • Table 7. VCC Overshoot Specifications

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      • Figure 2. VCC Overshoot Example Waveform

        24
    • 2.6.4 Die Voltage Validation

      24
  • 2.7 Signaling Specifications

    25
    • 2.7.1 FSB Signal Groups

      25
      • Table 8. FSB Signal Groups (Sheet 1 of 2)

        25
      • Table 9. Signal Characteristics

        26
      • Table 10. Signal Reference Voltages

        26
    • 2.7.2 CMOS and Open Drain Signals

      27
    • 2.7.3 Processor DC Specifications

      27
      • Table 11. GTL+ Signal Group DC Specifications

        27
      • Table 12. Open Drain and TAP Output Signal Group DC Specifications

        27
      • Table 13. CMOS Signal Group DC Specifications

        28
      • 2.7.3.1 GTL+ Front Side Bus Specifications

        28
        • Table 14. GTL+ Bus Voltage Definitions

          28
    • 2.7.4 Clock Specifications

      29
    • 2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking

      29
      • Table 15. Core Frequency to FSB Multiplier Configuration

        29
    • 2.7.6 FSB Frequency Select Signals (BSEL[2:0])

      29
      • Table 16. BSEL[2:0] Frequency Table for BCLK[1:0]

        30
    • 2.7.7 Phase Lock Loop (PLL) and Filter

      30
    • 2.7.8 BCLK[1:0] Specifications (CK505 based Platforms)

      30
      • Table 17. Front Side Bus Differential BCLK Specifications

        30
      • Figure 3. Differential Clock Waveform

        31
      • Figure 4. Differential Clock Crosspoint Specification

        31
      • Figure 5. Differential Measurements

        31
    • 2.7.9 BCLK[1:0] Specifications (CK410 based Platforms)

      32
      • Table 18. Front Side Bus Differential BCLK Specifications

        32
      • Figure 6. Differential Clock Crosspoint Specification

        32
  • 2.8 PECI DC Specifications

    33
    • Table 19. PECI DC Electrical Limits

      33
• 3 Package Mechanical Specifications

  35
  • Figure 7. Processor Package Assembly Sketch

    35
  • 3.1 Package Mechanical Drawing

    35
    • Figure 8. Processor Package Drawing Sheet 1 of 3

      36
    • Figure 9. Processor Package Drawing Sheet 2 of 3

      37
    • Figure 10. Processor Package Drawing Sheet 3 of 3

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    • 3.1.1 Processor Component Keep-Out Zones

      39
    • 3.1.2 Package Loading Specifications

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      • Table 20. Processor Loading Specifications

        39
    • 3.1.3 Package Handling Guidelines

      39
      • Table 21. Package Handling Guidelines

        39
    • 3.1.4 Package Insertion Specifications

      40
    • 3.1.5 Processor Mass Specification

      40
    • 3.1.6 Processor Materials

      40
      • Table 22. Processor Materials

        40
    • 3.1.7 Processor Markings

      40
      • Figure 11. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processor E6000 Series with 4 MB L2 Cache with 1333 MHz FSB

        40
      • Figure 12. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Series with 4 MB L2 Cache with 1066 MHz FSB

        41
      • Figure 13. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Series with 2 MB L2 Cache

        41
      • Figure 14. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E4000 Series with 2 MB L2 Cache

        42
      • Figure 15. Processor Top-Side Markings for the Intel® Core™2 Extreme Processor X6800

        42
    • 3.1.8 Processor Land Coordinates

      43
      • Figure 16. Processor Land Coordinates and Quadrants (Top View)

        43
• 4 Land Listing and Signal Descriptions

  45
  • 4.1 Processor Land Assignments

    45
    • Figure 17. land-out Diagram (Top View - Left Side)

      46
    • Figure 18. land-out Diagram (Top View - Right Side)

      47
    • Table 23. Alphabetical Land Assignments

      48
    • Table 24. Numerical Land Assignment

      58
  • 4.2 Alphabetical Signals Reference

    68
    • Table 25. Signal Description (Sheet 1 of 9)

      68
• 5 Thermal Specifications and Design Considerations

  77
  • 5.1 Processor Thermal Specifications

    77
    • 5.1.1 Thermal Specifications

      77
      • Table 26. Processor Thermal Specifications

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      • Table 27. Thermal Profile 1

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      • Figure 19. Thermal Profile 1

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      • Table 28. Thermal Profile 2

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      • Figure 20. Thermal Profile 2

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      • Table 29. Thermal Profile 3

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      • Figure 21. Thermal Profile 3

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      • Table 30. Thermal Profile 4

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      • Figure 22. Thermal Profile 4

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      • Table 31. Thermal Profile 5

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      • Figure 23. Thermal Profile 5

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    • 5.1.2 Thermal Metrology

      84
      • Figure 24. Case Temperature (TC) Measurement Location

        84
  • 5.2 Processor Thermal Features

    84
    • 5.2.1 Thermal Monitor

      84
    • 5.2.2 Thermal Monitor 2

      85
      • Figure 25. Thermal Monitor 2 Frequency and Voltage Ordering

        86
    • 5.2.3 On-Demand Mode

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    • 5.2.4 PROCHOT# Signal

      87
    • 5.2.5 THERMTRIP# Signal

      87
  • 5.3 Thermal Diode

    88
    • Table 32. Thermal “Diode” Parameters using Diode Model

      88
    • Table 33. Thermal “Diode” Parameters using Transistor Model

      89
    • Table 34. Thermal Diode Interface

      89
  • 5.4 Platform Environment Control Interface (PECI)

    90
    • 5.4.1 Introduction

      90
      • Figure 26. Processor PECI Topology

        90
      • 5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management

        90
        • Figure 27. Conceptual Fan Control on PECI-Based Platforms

          91
        • Figure 28. Conceptual Fan Control on Thermal Diode-Based Platforms

          91
    • 5.4.2 PECI Specifications

      92
      • 5.4.2.1 PECI Device Address

        92
      • 5.4.2.2 PECI Command Support

        92
      • 5.4.2.3 PECI Fault Handling Requirements

        92
      • 5.4.2.4 PECI GetTemp0() Error Code Support

        92
        • Table 35. GetTemp0() Error Codes

          92
• 6 Features

  93
  • 6.1 Power-On Configuration Options

    93
    • Table 36. Power-On Configuration Option Signals

      93
  • 6.2 Clock Control and Low Power States

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    • Figure 29. Processor Low Power State Machine

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    • 6.2.1 Normal State

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    • 6.2.2 HALT and Extended HALT Powerdown States

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      • 6.2.2.1 HALT Powerdown State

        94
      • 6.2.2.2 Extended HALT Powerdown State

        95
    • 6.2.3 Stop Grant and Extended Stop Grant States

      95
      • 6.2.3.1 Stop Grant State

        95
      • 6.2.3.2 Extended Stop Grant State

        96
    • 6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State

      96
      • 6.2.4.1 HALT Snoop State, Stop Grant Snoop State

        96
      • 6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State

        96
  • 6.3 Enhanced Intel® SpeedStep® Technology

    96
• 7 Boxed Processor Specifications

  99
  • Figure 30. Mechanical Representation of the Boxed Processor

    99
  • 7.1 Mechanical Specifications

    100
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      100
      • Figure 31. Space Requirements for the Boxed Processor (Side View)

        100
      • Figure 32. Space Requirements for the Boxed Processor (Top View)

        100
      • Figure 33. Space Requirements for the Boxed Processor (Overall View)

        101
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      101
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      101
  • 7.2 Electrical Requirements

    101
    • 7.2.1 Fan Heatsink Power Supply

      101
      • Figure 34. Boxed Processor Fan Heatsink Power Cable Connector Description

        102
      • Table 37. Fan Heatsink Power and Signal Specifications

        102
      • Figure 35. Baseboard Power Header Placement Relative to Processor Socket

        103
  • 7.3 Thermal Specifications

    103
    • 7.3.1 Boxed Processor Cooling Requirements

      103
      • Figure 36. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)

        104
      • Figure 37. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)

        104
    • 7.3.2 Fan Speed Control Operation (Intel® Core2 Extreme Processor X6800 Only)

      105
    • 7.3.3 Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor E6000 and E4000 Series Only)

      105
      • Figure 38. Boxed Processor Fan Heatsink Set Points

        105
      • Table 38. Fan Heatsink Power and Signal Specifications

        106
• 8 Balanced Technology Extended (BTX) Boxed Processor Specifications

  107
  • Figure 39. Mechanical Representation of the Boxed Processor with a Type I TMA

    107
  • Figure 40. Mechanical Representation of the Boxed Processor with a Type II TMA

    108
  • 8.1 Mechanical Specifications

    108
    • 8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions

      108
      • Figure 41. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes

        109
      • Figure 42. Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume

        110
    • 8.1.2 Boxed Processor Thermal Module Assembly Weight

      110
    • 8.1.3 Boxed Processor Support and Retention Module (SRM)

      111
      • Figure 43. Assembly Stack Including the Support and Retention Module

        111
  • 8.2 Electrical Requirements

    112
    • 8.2.1 Thermal Module Assembly Power Supply

      112
      • Figure 44. Boxed Processor TMA Power Cable Connector Description

        112
      • Table 39. TMA Power and Signal Specifications

        113
      • Figure 45. Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area)

        113
  • 8.3 Thermal Specifications

    114
    • 8.3.1 Boxed Processor Cooling Requirements

      114
    • 8.3.2 Variable Speed Fan

      114
      • Figure 46. Boxed Processor TMA Set Points

        115
      • Table 40. TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors

        115
• 9 Debug Tools Specifications

  117
  • 9.1 Logic Analyzer Interface (LAI)

    117
    • 9.1.1 Mechanical Considerations

      117
    • 9.1.2 Electrical Considerations

      117