Scheda Tecnica (LF80539GE0301M)SommarioContents31 Introduction71.1 Terminology71.2 References82 Low Power Features92.1 Clock Control and Low Power States92.1.1 Core Low-Power States112.1.1.1 C0 State112.1.1.2 C1/AutoHALT Powerdown State112.1.1.3 C1/MWAIT Powerdown State112.1.1.4 Core C2 State112.1.1.5 Core C3 State112.1.2 Package Low Power States122.1.2.1 Normal State122.1.2.2 Stop-Grant State122.1.2.3 Stop Grant Snoop State122.1.2.4 Sleep State122.1.2.5 Deep Sleep State132.2 Enhanced Intel SpeedStep® Technology132.3 FSB Low Power Enhancements142.4 Processor Power Status Indicator (PSI#) Signal153 Electrical Specifications173.1 Power and Ground Pins173.2 FSB Clock (BCLK[1:0]) and Processor Clocking173.3 Voltage Identification173.4 Catastrophic Thermal Protection203.5 Signal Terminations and Unused Pins213.6 FSB Frequency Select Signals (BSEL[2:0])213.7 FSB Signal Groups213.8 CMOS Signals233.9 Maximum Ratings233.10 Processor DC Specifications244 Package Mechanical Specifications and Pin Information294.1 Package Mechanical Specifications294.2 Processor Pinout and Pin List324.3 Alphabetical Signals Reference555 Thermal Specifications and Design Considerations635.1 Monitoring Processor Temperature645.1.1 Thermal Diode645.1.2 Thermal Diode Offset665.1.3 Intel® Thermal Monitor675.1.4 Digital Thermal Sensor685.1.5 Out of Specification Detection69Dimensioni: 668 KBPagine: 70Language: EnglishApri il manuale