Scheda TecnicaSommarioFeatures:1Universal Serial Bus (USB)1USB Driver and Software Support1SPI Master Peripheral1General Purpose Input/Output (GPIO) Pins1EEPROM1Package Types:1Other1Block Diagram21.0 Functional Description3TABLE 1-1: Pinout Description31.1 Supported Operating Systems41.1.1 ENUMERATION41.2 Control Module41.2.1 SPI INTERFACE41.2.2 INTERFACING TO THE DEVICE41.3 SPI Module41.3.1 SPI module features41.3.2 SPI module power-up configuration41.4 USB Protocol Controller41.4.1 DESCRIPTORS41.4.2 USB Events41.5 USB Transceiver51.5.1 INTERNAL PULL-UP RESISTORS51.5.2 MCP2210 POWER OPTIONS5FIGURE 1-1: MCP2210 INTERNAL POWER SUPPLY DETAILS5FIGURE 1-2: BUS POWER ONLY5FIGURE 1-3: TYPICAL POWER SUPPLY OPTION USING THE 5V PROVIDED BY THE USB6FIGURE 1-4: USING AN EXTERNALLY PROVIDED 3.3V POWER SUPPLY61.6 GP Module71.6.1 CONFIGURABLE PIN FUNCTIONS71.7 EEPROM Module81.8 Reset/POR81.8.1 Reset Pin81.8.2 POR81.9 Oscillator8FIGURE 1-5: QUARTZ CRYSTAL OPERATION8FIGURE 1-6: CERAMIC RESONATOR OPERATION82.0 MCP2210 Functional Description92.1 MCP2210 NVRAM Settings92.2 SPI Transfers9FIGURE 2-1: Chip Select to Data Delay9FIGURE 2-2: Data-to-Data Delay10FIGURE 2-3: Data to Chip Select Delay103.0 USB Commands/Responses Description113.1 NVRAM Settings113.1.1 Set Chip Settings Power-Up Default11TABLE 3-1: Command Structure11TABLE 3-2: Response 1 Structure13TABLE 3-3: Response 2 Structure14FIGURE 3-1: Set Chip Settings Power-up Default Logic Flow143.1.2 SET SPI power-up transfer settings15TABLE 3-4: Command Structure15TABLE 3-5: Response 1 Structure16TABLE 3-6: Response 2 Structure16TABLE 3-7: Response 3 Structure16FIGURE 3-2: SET SPI Power-up Transfer Settings Logic Flow173.1.3 SET USB Power-up Key Parameters18TABLE 3-8: Command Structure18TABLE 3-9: Response 1 Structure18TABLE 3-10: Response 2 Structure18FIGURE 3-3: SET USB power-up key parameters logic flow193.1.4 SET USB Manufacturer Name20TABLE 3-11: Command Structure20TABLE 3-12: Response 1 Structure20TABLE 3-13: Response 2 Structure20FIGURE 3-4: SET USB Manufacturer Logic Flow213.1.5 SET USB Product Name22TABLE 3-14: Command Structure22TABLE 3-15: Response 1 Structure22TABLE 3-16: Response 2 Structure22FIGURE 3-5: SET USB Product Name logic flow233.1.6 GET SPI Power-Up Transfer Settings24TABLE 3-17: Command Structure24TABLE 3-18: Response 1 Structure24FIGURE 3-6: GET SPI Power-Up Transfer Settings Logic Flow253.1.7 GET power-up Chip settings26TABLE 3-19: Command Structure26TABLE 3-20: Response 1 Structure26FIGURE 3-7: GET power-up Chip settings logic flow283.1.8 GET USB Key Parameters29TABLE 3-21: Command Structure29TABLE 3-22: Response 1 Structure29FIGURE 3-8: GET USB key parameters logic flow293.1.9 GET USB Manufacturer Name30TABLE 3-23: Command Structure30TABLE 3-24: Response 1 Structure30FIGURE 3-9: GET USB Manufacturer Name Logic Flow303.1.10 GET USB Product Name31TABLE 3-25: Command Structure31TABLE 3-26: Response 1 Structure31FIGURE 3-10: GET USB Product Name Logic Flow313.1.11 SEND ACCESS Password32TABLE 3-27: Command Structure32TABLE 3-28: Response 1 Structure32TABLE 3-29: Response 2 Structure32TABLE 3-30: Response 3 Structure32TABLE 3-31: Response 4 Structure33TABLE 3-32: Response 5 Structure33FIGURE 3-11: SEND ACCESS Password logic flow333.2 Read/Write RAM Settings343.2.1 GET (VM) SPI transfer settings34TABLE 3-33: Command Structure34TABLE 3-34: Response 1 Structure34FIGURE 3-12: GET (VM) SPI Transfer Settings Logic Flow353.2.2 SET (VM) SPI transfer settings36TABLE 3-35: Command 1 Structure36TABLE 3-36: Response 1 Structure37TABLE 3-37: Response 2 Structure39FIGURE 3-13: SET (VM) SPI transfer settings logic flow393.2.3 GET (VM) current chip settings39TABLE 3-38: Command Structure39TABLE 3-39: Response 1 Structure40FIGURE 3-14: GET (VM) Current Chip Settings Logic Flow423.2.4 SET (VM) current chip settings42TABLE 3-40: Command Structure42TABLE 3-41: Response 1 Structure45FIGURE 3-15: SET (VM) current chip settings logic flow453.2.5 GET (VM) GPIO current pin direction46TABLE 3-42: Command Structure46TABLE 3-43: Response 1 Structure46FIGURE 3-16: GET (VM) GPIO current pin direction logic flow463.2.6 SET (VM) GPIO current pin direction47TABLE 3-44: Command Structure47TABLE 3-45: Response 1 Structure47FIGURE 3-17: SET (VM) GPIO current pin direction logic flow473.2.7 GET GPIO current pin value48TABLE 3-46: Command Structure48TABLE 3-47: Response 1 Structure48FIGURE 3-18: GET GPIO current pin value logic flow483.2.8 SET GPIO current pin value49TABLE 3-48: Command Structure49TABLE 3-49: Response 1 Structure49FIGURE 3-19: SET GPIO current pin value logic flow493.3 Read/Write EEPROM Memory503.3.1 READ EEPROM Memory50TABLE 3-50: Command Structure50TABLE 3-51: Response 1 Structure50FIGURE 3-20: READ EEPROM Memory Logic Flow503.3.2 WRITE EEPROM Memory51TABLE 3-52: Command Structure51TABLE 3-53: Response 1 Structure51TABLE 3-54: Response 2 Structure51TABLE 3-55: Response 3 Structure51FIGURE 3-21: WRITE EEPROM Memory Logic Flow523.4 External Interrupt Pin (GP6) Event Status533.4.1 GET (VM) the current number of events from the interrupt pin53TABLE 3-56: Command Structure53TABLE 3-57: Response 1 Structure53FIGURE 3-22: GET (VM) The Current Number Of Events From The Interrupt Pin Logic Flow533.5 SPI Data Transfer543.5.1 Transfer SPI Data54TABLE 3-58: Command Structure54TABLE 3-59: Response 1 Structure54TABLE 3-60: ResponseS 2 Structure54TABLE 3-61: Response 3 Structure54TABLE 3-62: Response 4 Structure55TABLE 3-63: Response 5 Structure55FIGURE 3-23: Transfer SPI Data Logic Flow553.5.2 CANCEL the Current SPI Transfer56TABLE 3-64: Command Structure56TABLE 3-65: Response 1 Structure56FIGURE 3-24: CANCEL the current SPI transfer logic flow563.5.3 Request SPI bus Release57TABLE 3-66: Command Structure57TABLE 3-67: Response 1 Structure57TABLE 3-68: ResponseS 2 Structure57FIGURE 3-25: Request SPI bus Release logic flow583.6 Chip Status593.6.1 GET MCP2210 Status59TABLE 3-69: Command Structure59TABLE 3-70: Response 1 Structure59FIGURE 3-26: GET MCP2210 Status logic flow593.6.2 Unsupported command codes60TABLE 3-71: Command Structure60TABLE 3-72: Response 1 Structure604.0 Electrical Characteristics62Absolute Maximum Ratings (†)624.1 DC Characteristics63FIGURE 4-1: POR and POR Rearm with Slow Rising Vdd64TABLE 4-1: USB Module Specifications64TABLE 4-2: Thermal Considerations654.2 AC Characteristics664.2.1 Timing Parameter Symbology664.2.2 Timing Conditions66TABLE 4-3: Temperature and Voltage Specifications – AC66FIGURE 4-2: Load Conditions for device Timing Specifications664.2.3 Timing Diagrams and Specifications67TABLE 4-4: Reset, Oscillator Start-up Timer and Power-up Timer Parameters675.0 Packaging Information685.1 Package Marking Information68USB-to-SPI Protocol Converter with GPIO (Master Mode)1Appendix A: Revision History77Product ID System79Trademarks81Worldwide Sales and Service82Dimensioni: 1,15 MBPagine: 82Language: EnglishApri il manuale
Manuale UtenteSommarioTrademarks2Table of Contents3Preface5Introduction5Document Layout5Conventions Used in This Guide6Recommended Reading7The Microchip Web Site7Customer Support7Document Revision History7Chapter 1. Product Overview91.1 Introduction91.2 MCP2210 Breakout Module General Description91.3 What the MCP2210 Breakout Module Kit Includes9Chapter 2. Installation and Operation112.1 Introduction112.2 Board Setup112.3 Board Operation122.3.1 MCP2210 Breakout Board Operation122.3.2 MCP2210 Utility122.3.3 SPI Terminal Utility122.4 MCP2210 Typical Usage Scenarios14Appendix A. Schematic and Layouts17A.1 Introduction17A.2 Board – Schematic18A.3 Board – Top Silk and Pads19A.4 Board – Top Silk, Pads and Copper20A.5 Board – Top Pads and Copper21A.6 Board – Bottom Silk and Pads22A.7 Board – Bottom Silk, Pads and Copper23A.8 Board – Bottom Pads and Copper24Table B-1: Bill of Materials25Corporate Office26Atlanta26Boston26Chicago26Cleveland26Fax: 216-447-064326Dallas26Detroit26Indianapolis26Toronto26Fax: 852-2401-343126Australia - Sydney26China - Beijing26China - Shanghai26India - Bangalore26Korea - Daegu26Korea - Seoul26Singapore26Taiwan - Taipei26Fax: 43-7242-2244-39326Denmark - Copenhagen26France - Paris26Germany - Munich26Italy - Milan26Spain - Madrid26UK - Wokingham26Worldwide Sales and Service26Appendix B. Bill of Materials25Worldwide Sales and Service26Dimensioni: 370 KBPagine: 26Language: EnglishApri il manuale
