Manuale UtenteSommario1. Description12. Features13. Applications14. Pinning information24.1 Pinning25. Ordering information26. Limiting values27. Static characteristics38. Dynamic characteristics39. Test circuits510. Typical performance characteristics1011. Theory of operation1312. Bandwidth calculations1413. Noise1414. Dynamic range calculations1515. Application information1815.1 Die sales disclaimer2016. Package outline22SOT108-12217. Soldering2317.1 Introduction to soldering surface mount packages2317.2 Reflow soldering2317.3 Wave soldering2317.4 Manual soldering2417.5 Package related soldering information2418. Revision history2519. Data sheet status2620. Definitions2621. Disclaimers26Dimensioni: 507 KBPagine: 28Language: EnglishApri il manuale
Manuale UtenteSommario1. Description12. Features13. Applications14. Pinning information24.1 Pinning25. Ordering information26. Limiting values27. Static characteristics38. Dynamic characteristics39. Test circuits510. Typical performance characteristics1011. Theory of operation1312. Bandwidth calculations1413. Noise1414. Dynamic range calculations1515. Application information1815.1 Die sales disclaimer2016. Package outline22SOT108-12217. Soldering2317.1 Introduction to soldering surface mount packages2317.2 Reflow soldering2317.3 Wave soldering2317.4 Manual soldering2417.5 Package related soldering information2418. Revision history2519. Data sheet status2620. Definitions2621. Disclaimers26Dimensioni: 507 KBPagine: 28Language: EnglishApri il manuale
