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Motorola I580 ユーザーズマニュアル

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MECHANICAL PARTS REWORK AND REPAIR:  Recommended Equipment
68P80401P05
77
CHAPTER 9
MECHANICAL PARTS REWORK AND REPAIR
The following section details the equipment and procedures needed to correctly remove and replace 
specific Main Board components on the i580. 
9.1
Recommended Equipment
9.1.1
Hot Air Machine
Pace ThermoFlo 200 or similar. 
9.1.2
Preheater
X-Kar 1000-S or similar. 
9.1.3
High Performance Soldering Station
Pace HeatWise 200 with thermal recovery system or similar.
1. .6mm (0.06”) CHISEL (P/N1124-0019-P1) to fill lands (Big) during Land Preparation 
procedure.
2. 0.40mm (0.016”) 1/64” 60° BEVEL (P/N1124-0011-P1) to fill/level lands (Big) during Land 
Preparation procedure.
3. 10.80mm (.425”) BLADE (P/N1124-0501-P1) to wick off or level solder (BGAs) during Land 
Preparation procedure.
9.1.4
Microscope
Leica Stereozoom 6 or similar.
9.1.5
Magnifier Lamp 
5-diopter magnifier lamp.
9.1.6
Fume Absorber
Pace Arm-Evac 200 or similar.