Mitsubishi Electronics A953GOT ユーザーズマニュアル
6.1 GOT Main Unit
6.1.1 Handling instructions
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6 HANDLING
This chapter explains how to handle the GOT main unit and components.
6.1 GOT Main Unit
6.1.1
Handling instructions
This section describes the instructions for handling the GOT main unit and components.
DANGER
Before installing or removing the GOT main unit to or from an enclosure, always
turn the GOT power OFF before installing or removing the GOT main unit to or from
an enclosure.
Not doing so can cause a module failure or malfunction.
Before loading or unloading the communication module, communication board,
external I/O interface module or memory card interface module to or from the GOT,
always turn the GOT power OFF before loading or unloading the communication
module, external I/O interface module or memory card interface module to or from
the GOT.
Not doing so can cause a module failure or malfunction.
Before starting wiring, always turn the GOT power OFF before starting wiring.
Not doing so may cause an electric shock, product damage or malfunction.
turn the GOT power OFF before installing or removing the GOT main unit to or from
an enclosure.
Not doing so can cause a module failure or malfunction.
Before loading or unloading the communication module, communication board,
external I/O interface module or memory card interface module to or from the GOT,
always turn the GOT power OFF before loading or unloading the communication
module, external I/O interface module or memory card interface module to or from
the GOT.
Not doing so can cause a module failure or malfunction.
Before starting wiring, always turn the GOT power OFF before starting wiring.
Not doing so may cause an electric shock, product damage or malfunction.
CAUTION
The GOT should be used in the environment given in the general specifications of
this user's manual.
Not doing so can cause an electric shock, fire, malfunction or product damage or
deterioration.
When mounting the GOT main unit to an enclosure, tighten the mounting screws in
the specified torque range.
Undertightening can cause a drop, short circuit or malfunction.
Overtightening can cause a drop, short circuit or malfunction due to the damage of
the screws or module.
When loading the communication module to the GOT main unit, fit it to the
connection interface of the GOT and tighten the mounting screws in the specified
torque range.
Undertightening can cause a drop, failure or malfunction.
Overtightening can cause a drop, failure or malfunction due to the damage of the
screws or module.
Please make sure to ground FG terminal of the GOT power supply unit by applying
Class D Grounding (Class 3 Grounding) Method or higher which is used exclusively
for the GOT.
Correctly wire the power supply module on the GOT after confirming the rated
voltage and terminal arrangement of the product.
Not doing so can cause a fire or failure.
Exercise care to avoid foreign matter such as chips and wire offcuts entering the
module.
Not doing so can cause a fire, failure or malfunction.
this user's manual.
Not doing so can cause an electric shock, fire, malfunction or product damage or
deterioration.
When mounting the GOT main unit to an enclosure, tighten the mounting screws in
the specified torque range.
Undertightening can cause a drop, short circuit or malfunction.
Overtightening can cause a drop, short circuit or malfunction due to the damage of
the screws or module.
When loading the communication module to the GOT main unit, fit it to the
connection interface of the GOT and tighten the mounting screws in the specified
torque range.
Undertightening can cause a drop, failure or malfunction.
Overtightening can cause a drop, failure or malfunction due to the damage of the
screws or module.
Please make sure to ground FG terminal of the GOT power supply unit by applying
Class D Grounding (Class 3 Grounding) Method or higher which is used exclusively
for the GOT.
Correctly wire the power supply module on the GOT after confirming the rated
voltage and terminal arrangement of the product.
Not doing so can cause a fire or failure.
Exercise care to avoid foreign matter such as chips and wire offcuts entering the
module.
Not doing so can cause a fire, failure or malfunction.