Telit Wireless Solutions 1vv0300773a ユーザーズマニュアル
GE863-PRO
3
Hardware User Guide
1vv0300773a Rev. 0 - 24/01/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 3 of 64
7.2
RS232 level translation ........................................................................................................... 41
8
Audio Section Overview ................................................................................................ 44
8.1
INPUT LINES (Microphone) ................................................................................................... 45
8.1.1
Short description .............................................................................................................................45
8.1.2
Input Lines Characteristics .............................................................................................................46
8.2
OUTPUT LINES (Speaker) ..................................................................................................... 47
8.2.1
Short description .............................................................................................................................47
8.2.2
Output Lines Characteristics ...........................................................................................................48
9
The Evaluation Kit for Telit GE863-PRO
3
Modules ...................................................... 49
9.1.1
Short Description ............................................................................................................................49
10
GSM/GPRS General Purpose I/O................................................................................... 50
10.1 Using a GPIO Pad as INPUT ................................................................................................. 51
10.2 Using a GPIO Pad as OUTPUT ............................................................................................. 51
10.3 Using the RF Transmission Control GPIO7 ............................................................................ 51
10.4 Using the RFTXMON Output GPIO3 ...................................................................................... 51
10.5 Using the Alarm Output .......................................................................................................... 52
10.6 Using the Buzzer Output GPIO4 ............................................................................................ 52
10.7 Indication of network service availability ................................................................................. 53
10.8 RTC Bypass out ..................................................................................................................... 54
10.9 VAUX1 power output .............................................................................................................. 54
10.2 Using a GPIO Pad as OUTPUT ............................................................................................. 51
10.3 Using the RF Transmission Control GPIO7 ............................................................................ 51
10.4 Using the RFTXMON Output GPIO3 ...................................................................................... 51
10.5 Using the Alarm Output .......................................................................................................... 52
10.6 Using the Buzzer Output GPIO4 ............................................................................................ 52
10.7 Indication of network service availability ................................................................................. 53
10.8 RTC Bypass out ..................................................................................................................... 54
10.9 VAUX1 power output .............................................................................................................. 54
11
Mounting the GE863-PRO
3
on the Application Board ................................................. 55
11.1 General ................................................................................................................................... 55
11.1.1
Stencil .............................................................................................................................................55
11.1.2
PCB pad Design .............................................................................................................................55
11.1.3
Solder paste ....................................................................................................................................56
11.1.4
GE863-PRO
3
Solder Reflow ...........................................................................................................57
11.1.5
Packing System ..............................................................................................................................59
11.1.6
Moisture Sensibility .........................................................................................................................61
12
Conformity Assessment Issues .................................................................................... 62
13
SAFETY RECOMMANDATIONS..................................................................................... 63
14
Document Change Log .................................................................................................. 64