Seagate ST100FM0002 ユーザーズマニュアル
P
ULSAR
.2 SAS P
RODUCT
M
ANUAL
, R
EV
. C
41
If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 16. The air-flow patterns are created by one or
more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are
acceptable as long as the temperature measurement guidelines of Section 6.5.1 are met.
more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are
acceptable as long as the temperature measurement guidelines of Section 6.5.1 are met.
Figure 16.
Air flow
Note.
Image may not represent actual product, for reference only.
10.3
D
RIVE MOUNTING
Mount the drive using the bottom or side mounting holes. If mounting the drive using the bottom holes, ensure that you do not physically
distort the drive by attempting to mount it on a stiff, non-flat surface.
distort the drive by attempting to mount it on a stiff, non-flat surface.
The allowable mounting surface stiffness is 80 lb/in (14.0 N/mm). The following equation and paragraph define the allowable mounting
surface stiffness:
surface stiffness:
where K is the mounting surface stiffness (units in lb/in or N/mm) and X is the out-of-plane surface distortion (units in inches or millimeters).
The out-of-plane distortion (X) is determined by defining a plane with three of the four mounting points fixed and evaluating the out-of-plane
deflection of the fourth mounting point when a known force (F) is applied to the fourth point.
The out-of-plane distortion (X) is determined by defining a plane with three of the four mounting points fixed and evaluating the out-of-plane
deflection of the fourth mounting point when a known force (F) is applied to the fourth point.
10.4
G
ROUNDING
Signal ground (PCBA) and case ground are connected together in the drive and cannot be separated by the user. The equipment in which
the drive is mounted is connected directly to the drive with no electrically isolating shock mounts. If it is desired for the system chassis to
not be connected to the drive ground, the systems integrator or user must provide a nonconductive (electrically isolating) method of
mounting the drive in the host equipment.
the drive is mounted is connected directly to the drive with no electrically isolating shock mounts. If it is desired for the system chassis to
not be connected to the drive ground, the systems integrator or user must provide a nonconductive (electrically isolating) method of
mounting the drive in the host equipment.
Increased radiated emissions may result if designers do not provide the maximum surface area ground connection between system
ground and drive ground. This is the system designer’s and integrator’s responsibility.
ground and drive ground. This is the system designer’s and integrator’s responsibility.
Abo e nit
nder nit
Note Air lo s in the direction sho n (bac to ront)
or in re erse direction ( ront to bac )
Abo e nit
nder nit
Note Air lo s in the direction sho n or
in re erse direction (side to side)
K x X = F < 15lb = 67N