Intel 31244 PCI-X ユーザーズマニュアル
77
Thermal Solutions
Thermal Solutions
15
GD31244 is packaged in a 17 mm, 256-pin Plastic Ball Grid Array (PBGA) in an industry-standard
footprint. The package includes a four layer substrate with power and ground planes. The
construction of the package is shown below. The device is specified for operation when T
footprint. The package includes a four layer substrate with power and ground planes. The
construction of the package is shown below. The device is specified for operation when T
C
(case
temperature) is within the range of 0
o
C to 90
o
C, depending on the operating conditions. Refer to
for a details on the package.
15.1
Thermal Recommendations
Based on data Intel gathered while performing thermal validation, the GD31244 does not require a
heat sink. The tests were performed in an environment with no airflow, an ambient temperature of
60° C with the processor executing a maximum power test. However, when the case temperature
(108° C) is exceeded, a passive heat sink may be used.
heat sink. The tests were performed in an environment with no airflow, an ambient temperature of
60° C with the processor executing a maximum power test. However, when the case temperature
(108° C) is exceeded, a passive heat sink may be used.
Table 37.
Thermal Resistance
Symbol
Description
Value
Units
T
A
Still air ambient temperature to meet maximum case temperature
specifications: [T
specifications: [T
A
= T
C
- (P
DMAX
-
θ
ca
)]
70
o
C
θ
ca
Thermal resistance from case to ambient in still air including
conduction through the leads
conduction through the leads
20
o
C/Watt
Table 38.
544-Lead H-PBGA Package Thermal Characteristics
Thermal Resistance -
o
C/Watt
Parameter
Airflow - ft/min. (M./sec.)
0
100
200
400
600
θ
ca
Thermal Resistance from case to Ambient
20
12.5
11.2
10.2
9.2