Intel 200 ユーザーズマニュアル

Thermal and Mechanical Design Guidelines 

 19 

TDP 

220 

1.20 GHz 

512 KB 

19 

1, 4, 5 

 

T

J

 (°C) 

Junction Temperature 

0 °C 

100 °C 

NOTE:   

1. 

The TDP is not the maximum theoretical power the processor can generate. 

2. 

Not 100% tested. These power specifications are determined by characterization of the 

processor currents at higher temperatures and extrapolating the values for the 

temperature indicated. 

3. 

As measured by the activation of the on-die Intel

®

 Thermal Monitor. The Intel Thermal 

Monitor’s automatic mode is used to indicate that the maximum T

J

 

has been reached.  

Refer to datasheet for more details. 

4. 

The Intel Thermal Monitor automatic mode must be enabled for the processor to 

operate within specifications, please refer to datasheet for more details. 

5. 

At T

J

 of 100 °C.  

To remove the heat from the processor, three basic parameters should be considered:  

•  The area of the surface on which the heat transfer takes place.  Without 

any enhancements, this is the surface of the processor die.  One method used to 

improve thermal performance is by attaching a heatsink to the die.  A heatsink 

can increase the effective heat transfer surface area by conducting heat out of the 

die and into the surrounding air through fins attached to the heatsink base.  

•  The conduction path from the heat source to the heatsink fins.  Providing a 

direct conduction path from the heat source to the heatsink fins and selecting 

materials with higher thermal conductivity typically improves heatsink 

performance.  The length, thickness, and conductivity of the conduction path from 

the heat source to the fins directly impact the thermal performance of the 

heatsink.  In particular, the quality of the contact between the package die and 

the heatsink base has a higher impact on the overall thermal solution performance 

as processor cooling requirements become stricter.  Thermal interface material 

(TIM) is used to fill in the gap between the die and the bottom surface of the 

heatsink, and thereby improve the overall performance of the stack-up (die-TIM-

Heatsink).  With extremely poor heatsink interface flatness or roughness, TIM may 

not adequately fill the gap.  The TIM thermal performance depends on its thermal 

conductivity as well as the pressure applied to it.  Refer to Section 2.3.3 for 

further information. 

•  The heat transfer conditions on the surface on which heat transfer takes 

place.  Convective heat transfer occurs between the airflow and the surface 

exposed to the flow.  It is characterized by the local ambient temperature of the