Intel 200 ユーザーズマニュアル

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Thermal Metrology 
 
 
32  
 
Thermal and Mechanical Design Guidelines 
Figure 12.  Locations for Measuring Local Ambient Temperature, Passive Heatsink  
3MM AWAY FROM HEATSINK SIDES
TOP VIEW
POTISTION THERMOCOUPLES (X4) 
AT LOCATIONS AS INDICATED
TO MEASURE T
A
TC1
TC2
TC3
TC4
HALF OF HEATSINK FIN HEIGHT
SIDE VIEW
3MM AWAY FROM HEATSINK SIDES
TOP VIEW
POTISTION THERMOCOUPLES (X4) 
AT LOCATIONS AS INDICATED
TO MEASURE T
A
TC1
TC2
TC3
TC4
HALF OF HEATSINK FIN HEIGHT
SIDE VIEW
 
NOTE:  Drawing Not to Scale 
It is recommended that full and routine calibration of temperature measurement 
equipment be performed before attempting to perform temperature measurement.  
Intel recommends checking the meter probe set against known standards.  This 
should be done at 0 ºC (using ice bath or other stable temperature source) and at an 
elevated temperature, around 80 ºC (using an appropriate temperature source).  
Wire gauge and length also should be considered as some less expensive 
measurement systems are heavily impacted by impedance.  There are numerous 
resources available throughout the industry to assist with implementation of proper 
controls for thermal measurements. 
3.3 
Processor Power Measurement Metrology 
Recommendation 
This section recommends a metrology to measure power consumption of the Intel 
Celeron processor 200 sequence on the Intel Desktop Board D201GLY2.  Should there 
be any modification of motherboard layout or design, contact Intel field sales 
representative or product marketing staff for clarification of this metrology.