Cypress CY7C604XX ユーザーズマニュアル
CY7C604XX
Document Number: 001-12395 Rev *H
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Package Diagram
This section illustrates the packaging specifications for the enCoRe V LV device, along with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V LV emulation tools and their dimensions, refer to the development kit.
the enCoRe V LV emulation tools and their dimensions, refer to the development kit.
Packaging Dimensions
Figure 9. 16-Pin (3 x 3 mm) QFN (001-09116)
001-09116 *D