Cypress CY7C604XX ユーザーズマニュアル
CY7C604XX
Document Number: 001-12395 Rev *H
Page 28 of 30
Thermal Impedances
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Ordering Information
Package
Typical
θ
JA
16 QFN
32.69
o
C/W
32 QFN
19.51
o
C/W
48 QFN
17.68
o
C/W
Package
Minimum Peak Temperature
Maximum Peak Temperature
16 QFN
240
o
C
260
o
C
32 QFN
240
o
C
260
o
C
48 QFN
240
o
C
260
o
C
Ordering Code
Package Information
Flash
SRAM
No. of GPIOs
Target Applications
CY7C60413-16LKXC
16-Pin QFN (3x3 mm)
8K
1K
13
Feature-rich Wireless Mouse
CY7C64013-16LKXCT 16-Pin QFN (3X3 mm)
8K
1K
13
Feature-rich Wireless Mouse
CY7C60445-32LQXC
32-Pin QFN
(5x5x0.55 mm)
(5x5x0.55 mm)
16K
1K
28
Feature-Rich Wireless Mouse
CY7C60445-32LQXCT 32-Pin QFN - (Tape and Reel)
(5x5x0.55 mm)
16K
1K
28
Feature-Rich Wireless Mouse
CY7C60455-48LTXC
48-Pin QFN
(7x7x0.9 mm)
(7x7x0.9 mm)
16K
1K
36
Mid-Tier Wireless Keyboard
CY7C60455-48LTXCT
48-Pin QFN - (Tape and Reel)
(7x7x0.9 mm)
(7x7x0.9 mm)
16K
1K
36
Mid-Tier Wireless Keyboard
CY7C60456-48LTXC
48-Pin QFN
(7x7x0.9 mm)
(7x7x0.9 mm)
32K
2K
36
Feature-Rich Wireless
Keyboard
Keyboard
CY7C60456-48LTXCT
48-Pin QFN - (Tape and Reel)
(7x7x0.9 mm)
(7x7x0.9 mm)
32K
2K
36
Feature-Rich Wireless
Keyboard
Keyboard
Notes
23. T
J
= T
A
+ Power x
θ
JA.
24. To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.
25. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
25. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.