Renesas H8/300H Series ユーザーズマニュアル
9
2.3
Recommended Dimensions for User System Mount Pad
Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system
with an IC socket for an FP-100B/TFP-100B package (IC149-100-054-B51: manufactured by
YAMAICHI ELECTRONICS Co., Ltd.). Note that the dimensions in figure 5 are somewhat
different from those of the actual chip's mount pad.
with an IC socket for an FP-100B/TFP-100B package (IC149-100-054-B51: manufactured by
YAMAICHI ELECTRONICS Co., Ltd.). Note that the dimensions in figure 5 are somewhat
different from those of the actual chip's mount pad.
Unit: mm
0.50 ± 0.05
0.30 ± 0.05
0.5 x 24 = 12.00 ± 0.05
0.5 x 24 = 12.00 ± 0.05
13.80 (max.)
17.10 (min.)
0.50 ± 0.05
Figure 5 Recommended Dimensions for Mount Pad