Cypress CY7C64215 ユーザーズマニュアル
CY7C64215
Document 38-08036 Rev. *C
Page 29 of 30
Ordering Information
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Parameter
Description
Min
Typical
Max
Unit
T
BAKETEMP
Bake Temperature
125
See package label
°C
T
BAKETIME
Bake Time
See package label
72
hours
Package
Ordering Code
Flash Size
SRAM (Bytes)
56-Pin MLF
CY7C64215-56LFXC
16K
1K
28-Pin SSOP
CY7C64215-28PVXC
16K
1K