Nxp Semiconductors UM10237 ユーザーズマニュアル
UM10237_2
© NXP B.V. 2008. All rights reserved.
User manual
Rev. 02 — 19 December 2008
8 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
5.5 LPC2478 ordering options
6.
Architectural overview
The LPC2400 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
the ARM7 local bus for closely coupled, high speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2400 implements two AHB buses in order to allow the Ethernet block to operate
without interference caused by other system activity. The primary AHB, referred to as
AHB1, includes the VIC, GPDMA controller, and EMC.
without interference caused by other system activity. The primary AHB, referred to as
AHB1, includes the VIC, GPDMA controller, and EMC.
Table 10.
LPC2470 ordering options
Type number
Flash
(kB)
(kB)
SRAM (kB)
External
bus
bus
Ethernet
USB
OTG/
OHC/
Device
+ 4 kB
FIFO
OTG/
OHC/
Device
+ 4 kB
FIFO
C
AN cha
n
nels
SD/
MMC
MMC
GP
DMA
DMA
A
DC cha
n
nels
D
AC cha
n
nels
Temp
range
range
Loc
a
l bu
s
Ethernet buffer
GP/USB
RT
C
To
ta
l
LPC2470FBD208
N/A
64
16
16
2
98 Full
32-bit
MII/RMII
yes
2 yes
yes
8
1
−40 °C
to
+85
to
+85
°C
LPC2470FET208
N/A
64
16
16
2
98 Full
32-bit
MII/RMII
yes
2 yes
yes
8
1
−40 °C
to
+85
to
+85
°C
Table 11.
LPC2478 ordering information
Type number
Package
Name
Description
Version
LPC2478FBD208 LQFP208
plastic low profile quad flat package; 208 leads; body 28
× 28 × 1.4 mm
SOT459-1
LPC2478FET208
TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15
× 15 ×
0.7 mm
SOT950-1
Table 12.
LPC2478 ordering options
Type number
Flash
(kB)
(kB)
SRAM (kB)
External
bus
bus
Ethernet
USB
OTG/
OHC/
Device
+ 4 kB
FIFO
OTG/
OHC/
Device
+ 4 kB
FIFO
CAN channels
SD/
MMC
MMC
GP
DMA
DMA
ADC channels
DAC channels
Temp
range
range
Lo
cal
bu
s
Et
hernet buffer
GP/
U
SB
RTC
To
ta
l
LPC2478FBD208
512
64
16
16
2
98 Full
32-bit
MII/RMII
yes
2 yes
yes
8
1
−40 °C
to
+85
to
+85
°C
LPC2478FET208
512
64
16
16
2
98 Full
32-bit
MII/RMII
yes
2 yes
yes
8
1
−40 °C
to
+85
to
+85
°C