Motorola MCF5282 ユーザーズマニュアル
MOTOROLA
Chapter 32. Mechanical Data
32-7
Ordering Information
Figure 32-2. 256 MAPBGA Package Dimensions
32.2 Ordering Information
Table 32-2. Orderable Part Numbers
Motorola Part
Number
Description
Speed
Temperature
MCF5280CVF66
MCF5280 RISC Microprocessor, 256 MAPBGA
66.67 MHz
-40
°
to +85
°
C
MCF5280CVF80
MCF5280 RISC Microprocessor, 256 MAPBGA
80 MHz
-40
°
to +85
°
C
MCF5281CVF66
MCF5281 RISC Microprocessor, 256 MAPBGA
66.67 MHz
-40
°
to +85
°
C
MCF5281CVF80
MCF5281 RISC Microprocessor, 256 MAPBGA
80 MHz
-40
°
to +85
°
C
MCF5282CVF66
MCF5282 RISC Microprocessor, 256 MAPBGA
66.67 MHz
-40
°
to +85
°
C
MCF5282CVF80
MCF5282 RISC Microprocessor, 256 MAPBGA
80 MHz
-40
°
to +85
°
C
X
Y
D
E
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
0.20
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
M
M
3
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
10
11
12
13
14
15
16
e
15X
e
15X
b
256X
M
0.25
Y
Z
M
0.10
X
Z
S
DETAIL K
VIEW M-M
ROTATED 90 CLOCKWISE
°
S
A
Z
Z
A2
A1
4
0.15
Z
0.30
256X
5
K
NOTES:
1.
1.
DIMENSIONS ARE IN MILLIMETERS.
2.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
PER ASME Y14.5M, 1994.
3.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5.
PARALLELISM MEASUREMENT SHALL
DIM MIN
MAX
MILLIMETERS
A
1.25
1.60
A1
0.27
0.47
A2
1.16 REF
b
0.40
0.60
D
17.00 BSC
E
17.00 BSC
e
1.00 BSC
S
0.50 BSC