Intel 945GZ ユーザーズマニュアル

Thermal and Mechanical Design Guidelines   

 11 

This chapter provides the package description and loading specifications. The chapter 

also provides component thermal specifications and thermal design power descriptions 

for the (G)MCH.  

The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid 

Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm 

[0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the package is shown in 
Figure 9, 

Appendix B. 

The (G)MCH package uses a “balls anywhere” concept. The minimum ball pitch is  

0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers 

should ensure correct ball placement when designing for the non-grid array pattern. 

For exact ball locations relative to the package, contact your Field Sales 

Representative.