Lab.gruppen c 10 4x 補足マニュアル
conditions. Mains voltages can drop as much as 20% below nominal
before there is any effect on peak rail voltages.
before there is any effect on peak rail voltages.
Benefits: R.SMPS delivers full rail voltage to the output stage even
when mains current sags or fluctuates significantly, allowing the am-
plifier to exhibit consistent transient response and tight, undistorted
bass. Small size and high efficiency contribute to the extraordinary
power density of the C Series.
when mains current sags or fluctuates significantly, allowing the am-
plifier to exhibit consistent transient response and tight, undistorted
bass. Small size and high efficiency contribute to the extraordinary
power density of the C Series.
Intercooler® Cooling System
Technology: The overall C Series amplifier topology is exception-
ally efficient, from the power supply though the output stages.
Nevertheless, one must keep in mind how much power is passing
through the very compact chassis. The heat generated
ally efficient, from the power supply though the output stages.
Nevertheless, one must keep in mind how much power is passing
through the very compact chassis. The heat generated
per watt of
output is far less than with conventional designs.
Lab.gruppen’s Intercooler® cooling system is unique in two
respects. First, rather than mounting output devices on large
aluminum fins, Intercooler utilizes a copper heat sink with
thousands of very small, louvered fins. Copper dissipates heat much
more effectively than aluminum, and the thousands of small fins
vastly increase the total area exposed to the cooling airflow.
Many other amplifiers mount the output devices on a heat sink in a
“cooling tunnel,” with the coolest air hitting only the first output de-
vice. The last devices, at the end of the tunnel, are exposed to much
warmer air. This uneven cooling makes the last device in the tunnel
more susceptible to premature failure. With the C Series, however,
all output devices are mounted in a row perpendicular to the airflow.
Dual, variable speed fans force cool air into a pressure chamber,
from where it passes through the cooling fins for each device. None
receives “pre-heated” air for cooling.
respects. First, rather than mounting output devices on large
aluminum fins, Intercooler utilizes a copper heat sink with
thousands of very small, louvered fins. Copper dissipates heat much
more effectively than aluminum, and the thousands of small fins
vastly increase the total area exposed to the cooling airflow.
Many other amplifiers mount the output devices on a heat sink in a
“cooling tunnel,” with the coolest air hitting only the first output de-
vice. The last devices, at the end of the tunnel, are exposed to much
warmer air. This uneven cooling makes the last device in the tunnel
more susceptible to premature failure. With the C Series, however,
all output devices are mounted in a row perpendicular to the airflow.
Dual, variable speed fans force cool air into a pressure chamber,
from where it passes through the cooling fins for each device. None
receives “pre-heated” air for cooling.
Benefits: More efficient cooling ensures greater long-term
reliability. Parallel mounting of output devices in the
cooling airflow prevents premature failure of the “least-cooled”
devices.
reliability. Parallel mounting of output devices in the
cooling airflow prevents premature failure of the “least-cooled”
devices.
Technology Brief: Class TD, Regulated SMPS (R.SMPS™), and Intercooler®
L a b . g r u p p e n a b • S w e d e n
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w w w . l a b g r u p p e n . c o m
Item
no.
CT-CS
CT-CS