Intel MFS5520VI ユーザーズマニュアル
Functional Architecture
Intel® Compute Module MFS5520VI TPS
Revision
1.3
Intel order number: E64311-005
10
3.1.6
Unified Retention System Support
The Compute Module complies with Intel’s Unified Retention System (URS) and the Unified
Backplate Assembly. The Compute Module ships with a made-up assembly of Independent
Loading Mechanism (ILM) and Unified Backplate at each processor socket.
Backplate Assembly. The Compute Module ships with a made-up assembly of Independent
Loading Mechanism (ILM) and Unified Backplate at each processor socket.
The URS retention transfers load to the Compute Module through the unified backplate
assembly. The URS spring, captive in the heatsink, provides the necessary compressive load
for the thermal interface material. All components of the URS heatsink solution are captive to
the heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly.
See the following figure for the stacking order of the URS components.
assembly. The URS spring, captive in the heatsink, provides the necessary compressive load
for the thermal interface material. All components of the URS heatsink solution are captive to
the heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly.
See the following figure for the stacking order of the URS components.
.
AF002699
Heatsink
Screw
Compression Spring
Retention Cup
Thermal Interface Material (TIM)
Retaining Ring
Server Board
Heatsink
Attach Studs
ILM Attach Studs
Unified Backplate
ILM and Socket
Figure 5. Unified Retention System and Unified Backplate Assembly