Intel MFS5520VI ユーザーズマニュアル

ページ / 56
Revision History 
Intel® Compute Module MFS5520VI TPS 
 
 
 Revision 
1.3 
Intel order number: E64311-005 
ii 
Revision History 
Date 
Revision 
Number 
Modifications 
February, 2009 
1.0 
Initial release. 
June, 2009 
1.1 
Updated the document. 
March, 2010 
1.2 
Updated the document. 
April, 2010 
1.3 
Updated the document. 
 
 
 
 
 
 
 
Disclaimers 
Information in this document is provided in connection with Intel
®
 products. No license, express 
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this 
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel 
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to 
sale and/or use of Intel products including liability or warranties relating to fitness for a particular 
purpose, merchantability, or infringement of any patent, copyright or other intellectual property 
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. 
Intel may make changes to specifications and product descriptions at any time, without notice. 
Designers must not rely on the absence or characteristics of any features or instructions marked 
"reserved" or "undefined." Intel reserves these for future definition and shall have no 
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. 
The Intel
®
 Compute Module MFS5520VI may contain design defects or errors known as errata 
which may cause the product to deviate from published specifications. Current characterized 
errata are available on request. 
Intel Corporation server baseboards support peripheral components and contain a number of 
high-density VLSI and power delivery components that need adequate airflow to cool. Intel’s 
own chassis are designed and tested to meet the intended thermal requirements of these 
components when the fully integrated system is used together. It is the responsibility of the 
system integrator that chooses not to use Intel developed server building blocks to consult 
vendor datasheets and operating parameters to determine the amount of air flow required for 
their specific application and environmental conditions. Intel Corporation can not be held 
responsible if components fail or the compute module does not operate correctly when used 
outside any of their published operating or non-operating limits. 
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation. 
*Other brands and names may be claimed as the property of others. 
Copyright © Intel Corporation 2010.