Intel MFS5520VI ユーザーズマニュアル
Product Overview
Intel® Compute Module MFS5520VI TPS
Revision
1.3
Intel order number: E64311-005
2
2. Product Overview
The Intel
®
Compute Module MFS5520VI is a monolithic printed circuit board with features that
were designed to support the high-density compute module market.
2.1 Intel
®
Compute Module MFS5520VI Feature Set
Feature
Description
Processors
Support for one or two Intel
®
Xeon
®
Processor 5500 series or two Intel
®
Xeon
®
Processor 5600 series in FC-LGA 1366 Socket B package with up to 95 W Thermal
Design Power (TDP).
Design Power (TDP).
4.8 GT/s, 5.86 GT/s, and 6.4 GT/s Intel
®
QuickPath Interconnect (Intel
®
QPI)
Enterprise Voltage Regulator-Down (EVRD) 11.1
Memory
Support for 1066/1333 MT/s ECC registered (RDIMM) or unbuffered (UDIMM) DDR3
memory.
12 DIMMs total across 6 memory channels (3 channels per processor).
Note: Mixed memory is not tested or supported. Non-ECC memory is not tested and is
not supported in a server environment.
memory.
12 DIMMs total across 6 memory channels (3 channels per processor).
Note: Mixed memory is not tested or supported. Non-ECC memory is not tested and is
not supported in a server environment.
Chipset
Intel
®
5520 Chipset IOH
Intel
®
82801JR I/O Controller Hub (ICH10R)
On-board
Connectors/Headers
Connectors/Headers
External connections:
Four USB 2.0 ports
DB-15 Video connector
Internal connectors/headers:
One low-profile USB 2x5 pin header to support low-profile USB solid state drives
Intel
®
I/O Mezzanine connectors supporting Dual Gigabit NIC Intel
®
I/O Expansion
Module (Optional)
On-board Video
On-board ServerEngines* LLC Pilot II Controller
Integrated 2D Video Controller
32 MB DDR2 Memory
On-board Hard Drive
Controller
Controller
LSI* 1064e SAS controller
LAN
Two integrated 1000 Ethernet ports and two optional 1000 Ethernet ports, provided by
the Dual Gigabit NIC mezzanine module.
the Dual Gigabit NIC mezzanine module.