In Win BK623 IW-BK623.BN300TBL プリント

To design a small 12.5L SFF chassis with better thermal & acoustic 

performance than other bigger size chassis.

Optional screwless designs-ODD/FDD/HDD bays and top cover.

PPCT  is  the  world's  first  advanced  thermal  and  acoustic  cooling 

technology, which provides S.F.F. chassis with excellent thermal solutions 

while  creating  a  quieter  computing  experience.  PPCT  does  not  require 

second  fan;  yet  still  provides  an  excellent  thermal  solution.  The  3rd 

generation  of  PPCT  includes  an  adjustable  air  duct  for  various  CPU  fans 

and efficiently eliminates overheat while enhances airflow of entire system. 

The new PPCT also supports the LGA1156 socket.
Cooling Technology also supports the LGA1156 socket.

Compatible with all standard desktop components.

Easy system integration.

Small but flexible enough to accommodate four full height PCI cards. 

mATX Chassis

S.F.F Tiny Tower Chassis
Support Dual Core and Quad Core Processor
5.25" x 1, 3.5" x1
3.5" x 1
USB 2.0 x 4, HD Audio
12.7" x 5.5" x 10.8" 
323 x 140 x 276 mm (12.5L)
Micro ATX
Full Height Slots x 4
SFX 12V Form Factor,  300W
Intel Mt. Jade Ref. Design / Removable Air Filter 
New Partition Plate Cooling Technology (New PPCT)
No 2

nd

 Fan (Rear Fan) Needed 

Meets RoHS, CE and FCC Class B Requirements
Padlock Loop / Kensington Slot 
IEEE 1394 / IR / Chassis Intrusion Switch
Tool-Free ODD/FDD/ HDD Bay Clips
Tool-Free Side Panel Clips

Using Partition Plate Cooling Tech

*

 

BK Series uses Intel Mt. Jade as Ref. Design

* Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the 

   United States and other countries.

*The actual product is subject to change without prior notice. In Win Development Inc. 

  reserves the right to make final modifications.

BK623