Intel SR1695GPRX1AC ユーザーズマニュアル
Cooling Sub-System
Intel® Server System SR1695GPRX TPS
Revision
1.5
Intel order number: G11332-006
28
4. Cooling
Sub-System
Several components and configuration requirements make up the cooling sub-system of the
chassis. These include processors, chipsets, VR heatsinks, system fan module, power supply
fans, CPU air duct, and drive bay population. All are necessary to provide and regulate the air
flow and air pressure needed to maintain the system’s thermals when operating at or below the
maximum specified thermal limits.
chassis. These include processors, chipsets, VR heatsinks, system fan module, power supply
fans, CPU air duct, and drive bay population. All are necessary to provide and regulate the air
flow and air pressure needed to maintain the system’s thermals when operating at or below the
maximum specified thermal limits.
In order to maintain the necessary airflow within the system, you must properly install the air
duct and the top cover.
duct and the top cover.
The chassis uses a variable fan speed control engine to provide adequate cooling for the
system at various ambient temperature conditions, under various server workloads, and with the
least amount of acoustic noise possible. The fans operate at the lowest speed for any given
condition to minimize acoustics.
system at various ambient temperature conditions, under various server workloads, and with the
least amount of acoustic noise possible. The fans operate at the lowest speed for any given
condition to minimize acoustics.
Note: The server system does not support redundant cooling fans. If any of the fans fail, you
must power down the system as soon as possible to replace the fan.
must power down the system as soon as possible to replace the fan.
4.1
Processor Heatsink
A heatsink is included in the system package. This heatsink is designed for optimal cooling and
performance. To achieve better cooling performance, you must properly attach the heatsink
bottom base with TIM (thermal interface material). ShinEtsu* G-751 or 7783D or Honeywell*
PCM45F TIM is recommended. The mechanical performance of the heatsink must satisfy
mechanical requirement of Intel
performance. To achieve better cooling performance, you must properly attach the heatsink
bottom base with TIM (thermal interface material). ShinEtsu* G-751 or 7783D or Honeywell*
PCM45F TIM is recommended. The mechanical performance of the heatsink must satisfy
mechanical requirement of Intel
®
Xeon
®
3400 series and Core™ i3 series processors. To keep
chipsets and VR temperature at or below maximum temperature limit, the heatsink is required
if necessary.
if necessary.