Apple emac ati usb2 2005 サービスマニュアル

46 - eMac ATI Graphics/ USB 2.0/2005 Take Apart

 Thermal Paste Application

Thermal Paste Application

The microprocessor uses a heatsink/thermal pipe to transfer heat away. Whenever the 

heatsink is removed, the bottom side of the heatsink and the top of the microprocessor 

must be cleaned and thermal paste must be applied. If the mating surfaces are not 

cleaned and thermal paste is not applied, the CPU may overheat and become damaged.

This procedure requires the following tools:

• Plastic stylus or nylon probe tool (922-5065) to remove the old thermal paste

• Thermal paste (922-4757), each tube contains 4-5 applications

1.

Thoroughly clean the thermal film from the heatsink surface with a plastic stylus or the 

nylon probe tool. Do not use an abrasive material or liquid cleaner. Important: Be 

extremely careful not to bend the fins on the heatsink.