Samsung Digimax 240 ユーザーガイド

ページ / 60
3
C O N T E N T S
.. S
SP
PE
EC
CIIF
FIIC
CA
AT
TIIO
ON
N
1. SPECIFICATION ……………………………………………………………………………………………… 4
2. SYSTEM REQUIRMENT  ……………………………………………………………………………………… 5
3. TFT LCD PANEL MARK ………………………………………………………………………………………6
4. CONNECTION DIAGRAM ………………………………………………………………………………………8
5. PRODUCT EXTERIOR …………………………………………………………………………………………9
.. S
SO
OF
FT
TW
WA
AR
RE
E IIN
NS
ST
TA
AL
LL
LA
AT
TIIO
ON
N
………………………………………………………………………11
.. E
EX
XP
PL
LO
OD
DE
ED
D V
VIIE
EW
W A
AN
ND
D P
PA
AR
RT
TS
S L
LIIS
ST
T
1. MAIN ASSEMBLY …………………………………………………………………………………………… 16
2. PACKING ITEM  ………………………………………………………………………………………………18
3. INITIAL PARTS LIST …………………………………………………………………………………………20
.. A
AD
DJJS
SU
UT
TM
ME
EN
NT
T
1. REPLACEMENT PARTS AND ADJUSTMENT ITEMS …………………………………………………… 21
2. ADJUSTMENT TOOLS …………………………………………………………………………………………21
3. HOW TO CREAT THE TEST MODE …………………………………………………………………………22
4. TEST MODE THAT KINDS……………………………………………………………………………………25
5. FIRMWARE VERSION CHECK ………………………………………………………………………………26
6. FIRMWARE UPGRADE…………………………………………………………………………………………26
4. ADJUSTMENT ITEMS
1) FOCUS ADJUSTMENT ……………………………………………………………………………………28
2) AE/AWB ADJUSTMENT ……………………………………………………………………………………30
3) TRIG ADJUSTMENT ………………………………………………………………………………………31
5) STROBO ADJUSTMENT ……………………………………………………………………………………33
6) TFT LCD ADJUSTMENT……………………………………………………………………………………35
.. P
PR
RO
OD
DU
UC
CT
TS
S C
CO
ON
NS
ST
TR
RU
UC
CT
TIIO
ON
N
1. PARTS ARRANGEMENT FOR EACH PCB ASS’Y
1) MCU BOARD ASSEMBLY …………………………………………………………………………………34
2) POWER BOARD ASSEMBLY ……………………………………………………………………………36
3) SW1 BOARD ASSEMBLY …………………………………………………………………………………38
4) FLASH BOARD ASSEMBLY ………………………………………………………………………………39
5) JACK BOARD ASSEMBLY…………………………………………………………………………………40
6) CCD BOARD ASSEMBLY …………………………………………………………………………………41
7) SW2 BOARD ASSEMBLY …………………………………………………………………………………42
.. T
TR
RO
OU
UB
BL
LE
ES
SH
HO
OO
OT
TIIN
NG
G
1. BLOCK DIAGRAM ……………………………………………………………………………………………43
2. PRINCIPAL TROUBLESHOOTING ……………………………………………………………………………44
3. PARTS MODIFICATION ………………………………………………………………………………………46
4. PARTS EXPLAINTION OF EACH BOARD
1) MCU BOARD ASSEMBLY …………………………………………………………………………………48
2) POWER BOARD ASSEMBLY ……………………………………………………………………………50
3) SW1 BOARD ASSEMBLY …………………………………………………………………………………52
4) FLASH BOARD ASSEMBLY ………………………………………………………………………………53
5) JACK BOARD ASSEMBLY…………………………………………………………………………………54
5. DISASSEMBLE THE BARREL ASS'Y…………………………………………………………………………55
6. ASSEMBLE THE BARREL ASS'Y ……………………………………………………………………………60