Intel DQ67OWB3 BOXDQ67OWB3 ユーザーズマニュアル

製品コード
BOXDQ67OWB3
ページ / 4
Canada 
  ICES-003, Class B
europe 
  EMC directive 89/336/EEC; EN 55022:1998 
  Class B; EN 55024:1998
Australia/New Zealand 
  AS/NZS 3548, Class B
taiwan 
  CNS 13438, Class B International 
  CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via 
EN55022 +6 db in system configurations with an 
open chassis and EU Directive 89/336/EEC and use 
via EN55022 and EN50082-1 in a representative 
chassis.
Lead-Free: The symbol is used to identify 
electrical and electronic assemblies and 
components in which the lead (Pb) concen-
tration level in any of the raw materials and the end 
product is not greater than 0.1% by weight (1000 
ppm). This symbol is also used to indicate confor-
mance to lead-free requirements and definitions 
adopted under the European Union’s Restriction on 
Hazardous Substances (RoHS) directive, 2002/95/EC.
PROCeSSOR 
Processor Support 
• 2nd gen Intel® Core™ i7 vPro™, Intel® Core™ i5 vPro™, 
 and Intel® Core™ i3 processors in the LGA1155 package 
• Intel® Turbo Boost Technology
5
 
• Intel® Hyper-Threading Technology
6
 
• Integrated Memory Controller with support for up  
 to 32 GB
2
 of system memory using DDR3 1333 / 
  1066 MHz 
• Intel® Fast Memory Access 
• Supports Intel® 64 Architecture
9
ChiPSet
intel® Q67 express Chipset 
• Intel® 82Q67 Platform Controller Hub (PCH) 
• Intel® Active Management Technology
1
 7.0 
• Intel® Rapid Storage Technology (RAID 0, 1, 5, 10)
integrated intel® PCh Controllers 
• Six Hi-Speed USB 2.0 ports 
• Eight additional ports via internal headers 
• Two SATA 6.0 Gb/s ports and four SATA 3.0 Gb/s ports
System biOS 
• 32 Mb Flash EEPROM with Intel® Platform 
 Innovation Framework for EFI Plug and Play,  
  IDE drive auto-configure 
• Advanced configuration and power interface  
  V1.0b, DMI 2.5 
• Intel® Express BIOS update support
hardware Management Features 
• Processor fan speed control 
• System chassis fan speed control 
• Voltage and temperature sensing 
• Fan sensor inputs used to monitor fan activity 
• Power management support for ACPI 1.0b
  1
 Intel® Active Management Technology (Intel® AMT) requires 
the computer to have an Intel® AMT-enabled chipset, network 
hardware and software, connection with a power source, and a 
network connection.
  2
 System resources and hardware (such as PCI and PCI Express*) 
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction 
of as much as 1 GB or more of physical addressable memory being 
available to the operating system and applications, depending on 
the system configuration and operating system.
  3
 The original equipment manufacturer must provide TPM function-
ality, which requires a TPM-supported BIOS. TPM functionality 
must be initialized and may not be available in all countries.
  4
 The Intel® Core Utilities Bundle includes Intel® Integrator Assistant, 
Intel® Integrator Toolkit, Intel® Express Installer, and Intel® Express 
BIOS Update.
  5
 Intel® Turbo Boost Technology requires a PC with a processor with 
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-
ogy performance varies depending on hardware, software, and 
Intel® Desktop Board DQ67OW Executive Series  
Technical Specifications
intel® 82579LM eNeRGY StAR*-ready  
intel® PRO 10/100/1000 Network Connection 
• High quality and reliability with Intel’s world-class 
  manufacturing and validation 
• New low-power design
expansion Capabilities 
• One PCI Express* 2.0 x16 connector 
• One PCI Express 2.0 x4 connector 
• One PCI Express x1 connector 
• One PCI connector
Audio
• Eight-channel Intel® High Definition Audio
7
 with 
  multi-streaming 
• One front panel audio header 
• One internal S/PDIF output header
SYSteM MeMORY
Memory Capacity 
• Four 240-pin DIMM connectors supporting  
  up to four double-sided DIMMs
Memory types 
• DDR3 1333 / 1066 SDRAM memory support 
• Non-ECC Memory
Memory Voltage 
• Memory voltage control from 1.2 V to 1.8 V 
• 1.5 V standard JEDEC voltage
JuMPeRS AND FRONt-PANeL CONNeCtORS
Jumpers 
• Single configuration jumper design 
• Jumper access for BIOS maintenance mode
Front-Panel Connectors 
• Reset, HD LED, Power LEDs, power on/off 
• Four front panel Hi-Speed USB 2.0 headers 
• Front panel audio header
MeChANiCAL
board Style 
• MicroATX
board Size 
• 9.6” x 9.6” (24.38cm x 24.38cm)
baseboard Power Requirements 
• ATX 12 V
eNViRONMeNt
Operating temperature 
• 0° C to +55° C
Storage temperature 
• -20° C to +70° C
ReGuLAtiONS AND SAFetY StANDARDS
united States and Canada 
 UL 1950, Third edition—CAN/CSA C22.2 
  No. 950-95 with recognized U.S. and Canadian 
 component marks
europe 
 Nemko certified to EN 60950 International 
 Nemko certified to IEC 60950 
  (CB report with CB certificate)
eMC regulations (tested in representative 
chassis) 
united States 
  FCC Part 15, Class B 
  FCC Part 15, Class B open-chassis (cover off) testing
For ordering information, visit www.intel.com 
For the most current product information, visit www.intel.com/go/idb  
or http://ark.intel.com 
For specific processor compatibility, visit http://processormatch.intel.com
overall system configuration. Check with your PC manufacturer on 
whether your system delivers Intel Turbo Boost Technology. See 
  6
 Intel® Hyper-Threading Technology requires a computer system 
with a processor supporting HT Technology and an HT Technology-
enabled chipset, BIOS, and operating system. Performance will  
vary depending on the specific hardware and software you use. 
For more information including details on which processors support 
  7
 Intel® High Definition Audio requires a system with an appropriate 
Intel® chipset and a motherboard with an appropriate codec and  
the necessary drivers installed. System sound quality will vary 
depending on actual implementation, controller, codec, drivers,  
and speakers. For more information about Intel® HD Audio, refer  
  8
 Requires the use of a processor with Intel® HD Graphics.
  9
 64-bit computing on Intel® architecture requires a computer system 
with a processor, chipset, BIOS, operating system, device drivers, 
and applications enabled for Intel® 64 architecture. Processors 
will not operate (including 32-bit operation) without an Intel 64 
architecture-enabled BIOS. Performance will vary depending on 
your hardware and software configurations. See http://developer.
   INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION 
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY 
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY 
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN 
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, 
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO 
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY 
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR 
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
   Intel products are not intended for use in medical, life-saving,  
or life-sustaining applications. Intel may make changes to speci-
fications and product descriptions at any time, without notice.
   All products, dates, and figures specified are preliminary based 
on current expectations, and are subject to change without 
notice. Availability in different channels may vary.
   Actual Intel® Desktop Board may differ from the image shown.
   Intel, the Intel logo, Intel Core, Core Inside, and Intel vPro are 
trademarks of Intel Corporation in the U.S. and other countries..
 * Other names and brands may be claimed as the property of others.
   Copyright © 2010 Intel Corporation. All rights reserved.  
1210/TC/MS/PDF   324735-001US