Intel DQ67OWB3 BOXDQ67OWB3 ユーザーズマニュアル
製品コード
BOXDQ67OWB3
Canada
ICES-003, Class B
europe
europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
Australia/New Zealand
AS/NZS 3548, Class B
taiwan
taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use
via EN55022 and EN50082-1 in a representative
chassis.
Lead-Free: The symbol is used to identify
electrical and electronic assemblies and
components in which the lead (Pb) concen-
tration level in any of the raw materials and the end
product is not greater than 0.1% by weight (1000
ppm). This symbol is also used to indicate confor-
mance to lead-free requirements and definitions
adopted under the European Union’s Restriction on
Hazardous Substances (RoHS) directive, 2002/95/EC.
PROCeSSOR
Processor Support
• 2nd gen Intel® Core™ i7 vPro™, Intel® Core™ i5 vPro™,
and Intel® Core™ i3 processors in the LGA1155 package
• Intel® Turbo Boost Technology
5
• Intel® Hyper-Threading Technology
6
• Integrated Memory Controller with support for up
to 32 GB
2
of system memory using DDR3 1333 /
1066 MHz
• Intel® Fast Memory Access
• Supports Intel® 64 Architecture
9
ChiPSet
intel® Q67 express Chipset
• Intel® 82Q67 Platform Controller Hub (PCH)
• Intel® Active Management Technology
1
7.0
• Intel® Rapid Storage Technology (RAID 0, 1, 5, 10)
integrated intel® PCh Controllers
integrated intel® PCh Controllers
• Six Hi-Speed USB 2.0 ports
• Eight additional ports via internal headers
• Two SATA 6.0 Gb/s ports and four SATA 3.0 Gb/s ports
System biOS
System biOS
• 32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.5
• Intel® Express BIOS update support
hardware Management Features
hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
1
Intel® Active Management Technology (Intel® AMT) requires
the computer to have an Intel® AMT-enabled chipset, network
hardware and software, connection with a power source, and a
network connection.
2
System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system configuration and operating system.
3
The original equipment manufacturer must provide TPM function-
ality, which requires a TPM-supported BIOS. TPM functionality
must be initialized and may not be available in all countries.
4
The Intel® Core Utilities Bundle includes Intel® Integrator Assistant,
Intel® Integrator Toolkit, Intel® Express Installer, and Intel® Express
BIOS Update.
5
Intel® Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-
ogy performance varies depending on hardware, software, and
Intel® Desktop Board DQ67OW Executive Series
Technical Specifications
intel® 82579LM eNeRGY StAR*-ready
intel® PRO 10/100/1000 Network Connection
• High quality and reliability with Intel’s world-class
manufacturing and validation
• New low-power design
expansion Capabilities
expansion Capabilities
• One PCI Express* 2.0 x16 connector
• One PCI Express 2.0 x4 connector
• One PCI Express x1 connector
• One PCI connector
Audio
• Eight-channel Intel® High Definition Audio
Audio
• Eight-channel Intel® High Definition Audio
7
with
multi-streaming
• One front panel audio header
• One internal S/PDIF output header
SYSteM MeMORY
Memory Capacity
• Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
Memory types
Memory types
• DDR3 1333 / 1066 SDRAM memory support
• Non-ECC Memory
Memory Voltage
Memory Voltage
• Memory voltage control from 1.2 V to 1.8 V
• 1.5 V standard JEDEC voltage
JuMPeRS AND FRONt-PANeL CONNeCtORS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Four front panel Hi-Speed USB 2.0 headers
• Front panel audio header
MeChANiCAL
board Style
• MicroATX
board Size
board Size
• 9.6” x 9.6” (24.38cm x 24.38cm)
baseboard Power Requirements
baseboard Power Requirements
• ATX 12 V
eNViRONMeNt
Operating temperature
• 0° C to +55° C
Storage temperature
Storage temperature
• -20° C to +70° C
ReGuLAtiONS AND SAFetY StANDARDS
united States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
europe
europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
eMC regulations (tested in representative
eMC regulations (tested in representative
chassis)
united States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
For ordering information, visit www.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific processor compatibility, visit http://processormatch.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific processor compatibility, visit http://processormatch.intel.com
overall system configuration. Check with your PC manufacturer on
whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/turboboost for more information.
6
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technology-
enabled chipset, BIOS, and operating system. Performance will
vary depending on the specific hardware and software you use.
For more information including details on which processors support
HT Technology, see www.intel.com/info/hyperthreading.
7
Intel® High Definition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer
8
Requires the use of a processor with Intel® HD Graphics.
9
64-bit computing on Intel® architecture requires a computer system
with a processor, chipset, BIOS, operating system, device drivers,
and applications enabled for Intel® 64 architecture. Processors
will not operate (including 32-bit operation) without an Intel 64
architecture-enabled BIOS. Performance will vary depending on
your hardware and software configurations. See http://developer.
intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to speci-
fications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, Core Inside, and Intel vPro are
Intel, the Intel logo, Intel Core, Core Inside, and Intel vPro are
trademarks of Intel Corporation in the U.S. and other countries..
* Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved.
Copyright © 2010 Intel Corporation. All rights reserved.
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