Telit Communications S.p.A. GE864Q2B ユーザーズマニュアル
GE864
GE864
GE864
GE864----QUAD V2 / GE864
QUAD V2 / GE864
QUAD V2 / GE864
QUAD V2 / GE864----DUAL V2 Hardware User Guide
DUAL V2 Hardware User Guide
DUAL V2 Hardware User Guide
DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved.
Page 66 of 73
12.4.1.
12.4.1.
12.4.1.
12.4.1.
GE865 Solder reflow
GE865 Solder reflow
GE865 Solder reflow
GE865 Solder reflow
The following is the recommended solder reflow profile
Profile Feature
Profile Feature
Profile Feature
Profile Feature
Pb
Pb
Pb
Pb----Free Assembly
Free Assembly
Free Assembly
Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.